Abstract:Purpose
This study aims to analyze the wettability of the self-developed Sn–Bi–Zn solder and to conduct a series of analysis on the wetting kinetics, diffusion phenomenon and interfacial reaction of Sn–Bi–Zn solder on Cu substrate.
Design/methodology/approach
The wetting kinetics, diffusion phenomenon and interfacial reaction of Sn–Bi–Zn solder on Cu substrate were analyzed by experiments. The interface was observed by scanning electron microscope to study the effect of Zn content on its interface.
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