Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

Sung, Yong-Gue; Myung, Woo‐Ram; Jeong, Haksan; Ko, Min-Kwan; Moon, Jeong-Hoon; Jung, Seung‐Boo

doi:10.1007/s11664-018-6224-7

Cited by 11 publications

(5 citation statements)

References 18 publications

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“…With the addition of Pt NP to the Sn-58Bi solder, the growth of Ni 3 Sn 4 IMCs was suppressed, whereas the overall microstructure remained unchanged. This is consistent with previous reports on composite solders containing various NP fillers [ 6 , 7 , 8 , 9 , 10 , 11 , 12 ]. The growth behavior of the interfacial IMCs is discussed further in the next section.…”

Section: Resultssupporting

confidence: 93%

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Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

2022

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Pt-nanoparticle (NP)-alloyed Sn-58Bi solders were reacted with electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG) surface finishes. We investigated formation of intermetallic compounds (IMCs) and their diffusion barrier properties at reaction interfaces as functions of Pt NP content in the composite solders and duration of solid-state aging at 100 °C. At Sn-58Bi-xPt/ENIG interfaces, typical Ni3Sn4/Ni3P(P-rich layer) microstructure was formed. With the large consumption of the Ni-P layer, the Ni-P and Cu layers were intermixed and Cu atoms spread over the composite solder after 500 h of aging. By contrast, a (Pd,Ni)Sn4/thin Ni3Sn4 microstructure was observed at the Sn-58Bi-xPt/ENEPIG interfaces. The (Pd,Ni)Sn4 IMC effectively suppressed the consumption of the Ni-P layer and Ni3Sn4 growth, functioning as a good diffusion barrier. Therefore, the Sn-58Bi-xPt/ENEPIG joint survived 500 h of aging without microstructural degradation. Based on the experimental results and analysis of this study, Sn-58Bi-0.05Pt/ENEPIG is suggested as the optimum combination for future low-temperature soldering systems.

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Section: Resultssupporting

confidence: 93%

“…To overcome this embrittlement and to enhance mechanical properties, various fillers have been added into Sn-58Bi solder. They included alloying elements such as Cu, Ni, Ag, In, and Sb and nanoparticles such as carbon nanotube, graphene, Y 2 O 3 , Al 2 O 3 , and TiO 2 [ 6 , 7 , 8 , 9 , 10 , 11 , 12 ].…”

Section: Introductionmentioning

confidence: 99%

Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

2022

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“…This may be due to the presence of intermetallic compounds created when soldering to copper. The formation of the intermetallic compounds has been shown in prior research to embrittle the bond and reduce adhesion [45,48,54,61]. Intermetallic compounds grow with thermal ageing [54].…”

Section: Copper Cb230 Conductive Inkmentioning

confidence: 99%

Interconnections for Additively Manufactured Hybridized Printed Electronics in Harsh Environments

Neff

Elston

Schrand

2020

Designs

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The ability to fabricate functional 3D conductive elements via additive manufacturing has opened up a unique sector of ‘hybridized printed electronics’. In doing so, many of the rigid standards (i.e., planar circuit boards, potting, etc.,) of traditional electronics are abandoned. However, one critical challenge lies in producing robust and reliable interconnections between conductive inks and traditional hardware, especially when subjected to harsh environments. This research examines select material pairings for the most resilient interconnection. The method of test is wire bond pull testing that would represent a continuous strain on a connection and high acceleration testing of up to 50,000 g that would represent a sudden shock that electronics may experience in a drop or crash. Although these two environments may be similar to an overall energy exerted on the connection, the rate of force exerted may lead to different solutions. The results of this research provide insight into material selection for printed electronic interconnections and a framework for interconnection resiliency assessment, which is a critical aspect in realizing the production of next generation electronics technologies for the most demanding environments.

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“…Jung et al [26] found that the addition of epoxy to Sn-58Bi solder lowered the activation energy for IMC growth and thus reduced the IMCs' growth rate during aging, resulting in higher fracture energy and shear strength of the joint. Sung et al [27] reported that the Sn-58Bi epoxy solder joint had better thermal shock reliability, which could withstand more cycles than the original solder joint. Our group [28] reported that, after undergoing 1000 thermal cycles or 1000 h humidity treatment, the epoxy layer on the joint surface continued to deliver a noticeable mechanical enhancement to the Sn-58Bi joint.…”

Section: Introductionmentioning

confidence: 99%

Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints

Zhang,

Xue,

Liu

et al. 2023

Polymers

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With the rapid iteration of microsystem integrated technology, the miniaturization of electronic devices requires packaging materials with higher reliability. In this work, the microstructure evolution and mechanical properties of novel epoxy composite SAC305 solder joints were studied after isothermal aging to evaluate the enhanced effect of epoxy addition. The thickness variation and morphological evolution of the interfacial layer were analyzed. The results showed that, as the aging time was prolonged, the Cu6Sn5 interfacial layer remarkably coarsened and Cu3Sn compounds formed between the Cu6Sn5 layer and Cu pad due to the continuous atomic diffusion. Compared with the monolithic joint, the epoxy composite SAC305 joints had a lower overall IMC growth rate during aging, closely related to the initial morphologies of the interfacial layers. The shear test results showed an apparent decrease in the shear forces of all the solder joints as the aging time increased. Nevertheless, because of the extra mechanical support provided by the epoxy layer, the epoxy composite joints demonstrated notably enhanced mechanical properties. After 1000 h aging treatment, the shear force of SAC305 joints containing 8 wt.% epoxy was 26.28 N, showing a 24.08% increase over the monolithic joint. Cu-Sn IMCs were detected on the shear fracture of the monolithic joint after 1000 h aging, indicating the fracture occurred near the interface and displayed a ductile/brittle mixed fracture. Concerning the epoxy composite joints, cracks were still initiated and extended within the solder bulk, demonstrating a noticeable enhancement in ductility due to the addition of epoxy.

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Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

Cited by 11 publications

References 18 publications

Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

Interconnections for Additively Manufactured Hybridized Printed Electronics in Harsh Environments

Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints

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