Mechanical property and fracture behavior characterizations of 96.5 Sn–3.0 Ag–0.5 Cu solder joints

Strain rate sensitivity of Sn–3.0Ag–0.5Cu solder investigated by nanoindentation

“…Due to the considerations of environmental safety and human health, conventional Pb-Sn solder has been gradually prohibited. Among the numerous environmentally friendly leadfree solders, SnAgCu system solder alloy with its excellent mechanical properties and solder joint quality is of particular interest [1][2][3][4]. Given the complex service conditions of electronic products, research on the fracture and deformation behaviors [3][4][5][6], nanomechanical properties as a function of temperature [5][6][7][8][9][10] have been performed for lead-free solders recently.…”

The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

“…So far, most of the studies focused on the effects of Ag content and metal additions on the solder microstructures [7][8][9][10][13][14][15][16][17][18][19][20][21][22][23][24][25]. Even though some researchers [2,26,27] investigated the effect of Ag content on fracture behavior and fatigue properties of Sn-Ag-Cu solder, there is a lack of a systematic investigation in the effect of Ag content and metal additions on the mechanical properties of Sn-Ag-Cu solders, e.g., elastic modulus and yield stress. Such mechanical property data are essential for finite element modeling and simulation to help in the design-for-reliability of electronic assembly.…”

Revisiting mechanisms to inhibit Ag3Sn plates in Sn–Ag–Cu solders with 1wt.% Zn addition

“…Sn-Ag-Cu alloys, as promising candidates for replacing the toxic Pb-bearing solders in surface mounting technology, have been widely accepted [1][2][3]. For example, Sn-3.0Ag-0.5Cu has become a standard solder in the electronic industry and Sn-1.0Ag-0.5Cu has been proved a superior resistance to drop failure [4].…”