Strain rate sensitivity of Sn–3.0Ag–0.5Cu solder investigated by nanoindentation

Xiao, Gesheng; Gao, Yuan; Jia, Chunnan; Yang, Xinqi; Li, Zhigang; Shu, Xuefeng

doi:10.1016/j.msea.2014.06.113

Cited by 43 publications

(17 citation statements)

References 20 publications

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“…Recently, depth-sensing indentation (DSI) has become widely accepted as an alternative approach for mechanically characterizing bulk solids due to the associated simple sample preparation and the need for only a very small volume of testing material [26]. The use of DSI provides an opportunity for measuring the SRS using nanoindentation testing and recently there are reports describing the measuring of SRS from nanoindentation of various UFG metals including Al [27,28], Cu [28,29], Mg alloys [30,31], Ni [28], Sn-Ag-Cu [32], Zn-Al [28,33] a CoCrFeNiMn high-entropy alloy [34,35] and an AlMg nanocomposite [36]. However, an evaluation shows that relatively little information is available comparing the values of the SRS measured for the same material using conventional tensile testing and nanoindentation and it is reasonable to anticipate that these two different straining conditions may affect the measurements of SRS.…”

Section: Introductionmentioning

confidence: 99%

Self-annealing in a two-phase Pb-Sn alloy after processing by high-pressure torsion

Zhang

Chinh

Kawasaki

et al. 2016

Materials Science and Engineering: A

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A Pb-62% Sn two-phase eutectic alloy was processed by high-pressure torsion (HPT) and stored at room temperature (RT) to investigate the occurrence of self-annealing. The microstructural characteristics and mechanical properties were recorded during self-annealing using scanning electron microscopy, tensile testing and nanoindentation. Processing by HPT produces a weakening effect but storage at RT leads to a gradual increase in the hardness together with significant grain growth. Nanoindentation tests were performed by applying both the indentation depth-time (h-t) relationship at the holding stage and the hardness, H, at various loading rates in order to explore the evolution of the strain rate sensitivity (SRS), m.The results obtained by tensile testing and nanoindentation are consistent despite the large difference in the volumes of the examined regions, thereby confirming the validity of using nanoindentation to measure the strain rate sensitivity.

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Section: Introductionmentioning

confidence: 99%

Self-annealing in a two-phase Pb-Sn alloy after processing by high-pressure torsion

Zhang

Chinh

Kawasaki

et al. 2016

Materials Science and Engineering: A

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“…3. The fluctuation and instability of the elastic modulus and hardness are caused by the indentation size effect [20]. Onitsch [22] proposed that the size effect depended on grain size of material.…”

Section: Resultsmentioning

confidence: 99%

“…There are three common ways to carry out indentation tests; namely, with constant load (P), constant loading rate ð _ PÞ, and with constant strain rate ð_ ε; i:e:; CSMÞ. It has been proposed that the constant indentation strain rate condition should be applied by performing load-controlled indentations with a constant loading rate ð _ P=PÞ [19,20]. To understand the effect of strain rate on the micromechanical behavior of the ceramics, indentation tests were performed based on CSM under five loading rates ð _ P=PÞ of 0.01, 0.02, 0.05, 0.1, and 0.2 s À 1 .…”

Section: Methodsmentioning

confidence: 99%

Creep-related micromechanical behavior of zirconia-based ceramics investigated by nanoindentation

Liu

Wang

Xiao

et al. 2015

Ceramics International

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“…Upon the maximum depth, the indenter was held for 10 s prior to the unloading stage until the full recovery of indentation. The holding stage is important to alleviate the creep effect and ensure the elastic deformation in the unloading stage [11].…”

Section: Long Et Almentioning

confidence: 99%

Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments

Long

Wang

Feng

et al. 2017

Materials Science and Engineering: A

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In this study, residual stress in Sn-3.0Ag-0.5Cu lead-free solder after annealing at varying temperature and duration was investigated by nanoindentation and uniaxial tensile experiments. Based on the unloading response of load-penetration depth, the contact stiffness was theoretically calculated and found to be decreased with increasing annealing duration especially at the annealing temperature of 210°C. Additionally, the effect of residual stress on constitutive behaviour at strain rates of 1×10 −3 s −1 , 5×10 −4 s −1 and 1×10 −4 s −1 was consistently observed. By correlating residual stress and elastic indentation recovery, it was confirmed that greater contact stiffness is induced by greater compressive residual stress. Therefore, the optimal annealing condition of SAC305 solder is 210°C for 12 h, which is believed to minimize the residual stress and stabilize the mechanical property of annealed solder.

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Strain rate sensitivity of Sn–3.0Ag–0.5Cu solder investigated by nanoindentation

Cited by 43 publications

References 20 publications

Self-annealing in a two-phase Pb-Sn alloy after processing by high-pressure torsion

Self-annealing in a two-phase Pb-Sn alloy after processing by high-pressure torsion

Creep-related micromechanical behavior of zirconia-based ceramics investigated by nanoindentation

Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments

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