2010
DOI: 10.1016/j.jallcom.2010.07.160
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The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

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Cited by 141 publications
(55 citation statements)
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References 29 publications
(70 reference statements)
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“…3. This observation correlated with the study on Sn-Ag-Cu solder system by [36,37]. In this research, this incident was analysed as well and the reason for these different phases and microstructure formations is due to the effect of the solidification process which has also been reported by [38] for the Sn-3.5Ag-0.7Cu.…”
Section: Microstructure Propertiessupporting
confidence: 83%
“…3. This observation correlated with the study on Sn-Ag-Cu solder system by [36,37]. In this research, this incident was analysed as well and the reason for these different phases and microstructure formations is due to the effect of the solidification process which has also been reported by [38] for the Sn-3.5Ag-0.7Cu.…”
Section: Microstructure Propertiessupporting
confidence: 83%
“…The main reason for weak mechanical properties of the solder joint is the extensive formation of Ag3Sn and Cu6Sn5 IMC, so these problems need to be resolved. For that reason, the industries mostly use the low-Ag SAC solder alloys such as SAC105, SAC205 and, SAC305, which have low cost and better performance than eutectic or near-eutectic SAC alloys in drop impact reliability [1][2][3][4][5][6][7].…”
Section: Introductionmentioning
confidence: 99%
“…Since 2006 the environmental protection agencies (RoHS and WEEE) have banned the lead-containing portable electronic products because lead and leadcontaining products are toxic substances and it would be very harmful to the well-being of humans and the environment. So, the researchers are trying to find the other alternatives without Pb, and lead-free solders are good alternatives because lead-free solders are non-toxic [3][4][5][6][7][8].…”
Section: Introductionmentioning
confidence: 99%
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“…In order to reduce the costs and promote solder qualities, low-silver SAC solder emerged at a historic moment 4) . With the Ag content decreased, however, higher melting temperature of the low-silver SAC solder will lead to a series of problems, like increased the melting range, declined the wettability, coarsened the matrix microstructure and reduced the mechanical properties 5,6) . A lot of researches have been done to solve these problems, for example, adding a certain content of Bi in SAC0307 can reduce the melting point of solder and improve the wettability 7) .…”
Section: Introductionmentioning
confidence: 99%