Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests

Lee, Choong‐Jae; Min, Kyung Deuk; Park, Hyun Joon; Jung, Seung‐Boo

doi:10.1016/j.jallcom.2019.153077

Cited by 36 publications

(15 citation statements)

References 34 publications

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“…Among them, when the welding temperature is 270°C, the IMC thickness of the solder joint cross section is the smallest. According to reports, 42 when a thick IMC layer is formed at the interface, the reliability of the interface between the solder and the substrate will decrease. It is speculated that this phenomenon is related to the decrease of interface bonding area.…”

Section: Analysis Of Chip Average Shear Force Under Different Solderimentioning

confidence: 99%

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints

Zhai

Zou

et al. 2021

Journal of Elec Materi

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This paper investigates the effect of soldering temperature on solder joint voids and reliability of flip-chip LED chips during reflow soldering. Lead-free solder SAC305 was used as solder paste. The void ratio of the flip-chip LED solder joint at 250°C, 260°C, 270°C, 280°C, and 290°C reflow soldering temperatures was detected by x-ray detector. Shear tests were conducted to evaluate the influence of interfacial reactions on the mechanical reliability of solder joints. The distribution of voids in the shear section was observed by scanning electron microscope (SEM). Next, the photoelectric and thermal properties of FC-LED filament were tested and analyzed. Finally, a hightemperature and high-humidity aging experiment was carried out to test the reliability of the LED filament. The results show that the void ratio of the LED filament soldering joint is the lowest when the soldering temperature is 270°C. The small void ratio of the solder joints results in lower steady-state voltage and junction temperature of the flip-chip LED filament. As the void density in the solder joint decreases, the shear strength of the solder joint increases. At this time, the shear resistance and mechanical reliability are the highest.

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Section: Analysis Of Chip Average Shear Force Under Different Solderimentioning

confidence: 99%

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints

Zhai

Zou

et al. 2021

Journal of Elec Materi

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“…1. The Sn-Bi-Ag solder powder and flux (CVP-520, Alpha Assembly Solutions Inc., Korea) were agitated by mechanical stirring using a paste mixing machine, following the method of Kim [28,29]. In order to fabricate solder joints, all the dummy chips were commercial, which had large area of exposed Cu substrate at the center of the bottom for the facilitation of reflow.…”

Section: Experiments Proceduresmentioning

confidence: 99%

Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling

Chen

Wang

Gao

et al. 2021

J Mater Sci: Mater Electron

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Although many studies have reported the behaviors of thermal cycling of Snbased solder joints, the corresponding mechanism is difficult to describe universally due to the complexity of different cases. In the present study, microstructural evolution and failure of Sn-Bi57-Ag0.7 solder joints caused by thermal cycling between -40 and 85 °C from 0 to 1000 cycles were systematically investigated. The results indicated that the Sn-Bi-Ag solder joint was composed of Sn-rich phase, Bi-rich phase, large numbers of Bi dispersed-particles, and Ag 3 Sn precipitate. With the extension of time during thermal cycling, the microstructure of Sn-Bi-Ag solder joint gradually coarsened and the IMC layer became thicker (from 0.82 to 2.38 lm). However, Sn-Bi-Ag solder joints failed after 3000 thermal cycles. Two different stages of failure were found and the mechanism, related to the increment of thermal mismatch stress, was illuminated. Furthermore, Electron Backscattered Diffraction was used to detailedly elucidate the grain characteristics of the failed Sn-Bi-Ag solder joints, and the effect of thermal stress on orientations of Sn and Bi grains was also revealed. Being different from the orientation change observed in traditional Sn-Bi eutectic solder joints in previous studies, the present results demonstrated that both Sn and Bi grains did not present any preferred orientations after thermal cycling. And the reason of this phenomenon might be attributed to the Ag 3 Sn, which could be regarded as second-phase particles. Our present work would provide theoretical guidance for the development of new Sn-Bi-X solders with high reliabilities.

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“…The tensile strength and elongation decrease with the further increase of the content of Ni-CNTs due to the existence of CNTs clusters and the increase of brittleness. Lee et al [117] investigated the mechanical properties of Sn-58Bi solder joints by multi walled carbon nanotubes (MWCNTs) coated with Ag. They found that the addition of trace Ag-MWCNTs nanoparticles improved the shear strength of Sn-58Bi solder joints.…”

Section: Sn-bi Low Temperature Lead-free Soldermentioning

confidence: 99%

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Zhang

Gao

et al. 2020

Science and Technology of Advanced Materials

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Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests

Cited by 36 publications

References 34 publications

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints

Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

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