Mechanical characterization of MEMS materials

Stanimirovic, Z.; Stanimirovic, I.

doi:10.1109/miel.2012.6222827

Cited by 5 publications

(4 citation statements)

References 6 publications

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“…The pMUT has been fabricated using standard bulk micromachining fabrication techniques. Silicon nitride, silicon oxide and polysilicon are usually used as vibration diaphragms of MEMS devices, but the thicknesses of the three films are not more than 1 μm due to the deposition technique limits [ 37 , 38 , 39 , 40 ]. To get a higher and more accurate resonant frequency, the vibration diaphragm of pMUT should have greater and more precise thickness.…”

Section: Microfabrication Of Pmutmentioning

confidence: 99%

Design and Fabrication of Piezoelectric Micromachined Ultrasound Transducer (pMUT) with Partially-Etched ZnO Film

Ren

Fan

et al. 2017

Sensors

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A square piezoelectric composite diaphragm was analyzed by the finite element method to enhance the sensitivity of a piezoelectric micromachined ultrasound transducer (pMUT). The structures of electrode and piezoelectric film were optimized and a centric electrode was designed to avoid the counteraction of stress in the centre and edges. In order to further improve the sensitivity; a pMUT with partially-etched piezoelectric film was adopted. The receive and transmit sensitivities of the pMUT were analyzed in details. The receive sensitivity of pMUT with partially-etched ZnO film is 3.3 dB or 6.8 dB higher than those with a centric and whole electrode, respectively; and the amplitude of a partially-etched ZnO film pMUT under a certain voltage is 5.5 dB and 30 dB higher than those with centric and whole electrode separately. Two pMUT-based ZnO films were fabricated by micromachining technology and their receive and transmit sensitivities were tested. The ZnO films deposited by direct current (DC) magnetron sputtering exhibit a densely packed structure with columnar crystallites. The test results show that the structure of the square diaphragm with partially-etched piezoelectric layer can significantly improve the transducer sensitivity. The receive sensitivity and transmit sensitivity are −238.35 dB (ref. 1 V/μPa) and 150.42 dB (ref. 1 μPa/V); respectively.

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Section: Microfabrication Of Pmutmentioning

confidence: 99%

Design and Fabrication of Piezoelectric Micromachined Ultrasound Transducer (pMUT) with Partially-Etched ZnO Film

Ren

Fan

et al. 2017

Sensors

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“…These material properties can be classified as mechanical, electrical, chemical, thermal etc. These MEMS resonators are often used in extreme and hard environment, a virtuous knowledge is progressively imperative in eliminating some of reasons of device failure through proper material selection, design and method of fabrication [68]. Mechanical properties can be further categories into three forms.…”

Section: Materials Selectionmentioning

confidence: 99%

Si-based MEMS resonant sensor: A review from microfabrication perspective

Verma

Mondal

Gupta

2021

Microelectronics Journal

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With the technological advancement in micro-electro-mechanical systems (MEMS), microfabrication processes along with digital electronics together have opened novel avenues to the development of small-scale smart sensing devices capable of improved sensitivity with a lower cost of fabrication and relatively small power consumption. This article aims to provide the overview of the recent work carried out on the fabrication methodologies adopted to develop silicon based resonant sensors. A detailed discussion has been carried out to understand critical steps involved in the fabrication of the silicon-based MEMS resonator. Some challenges starting from the materials selection to the final phase of obtaining a compact MEMS resonator device for its fabrication have also been explored critically.

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“…The electrical properties of these materials are well established; however, their mechanical properties in analyzing the fatigue for the prediction of the lifetime of a MEMS device is still not well understood. Consequently, the fatigue lives of silicon and polysilicon by means of its reliance on the applied stresses under various environmental effects have been explored [100][101][102].…”

Section: Effects Of Humidity and Temperature On The Reliability Of Memsmentioning

confidence: 99%

Reliability and Fatigue Analysis in Cantilever-Based MEMS Devices Operating in Harsh Environments

Jan

Hamid

Khir

et al. 2014

Journal of Quality and Reliability Engineering

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The microelectromechanical system (MEMS) is one of the most diversified fields of microelectronics; it is rated to be the most promising technology of modern engineering. MEMS can sense, actuate, and integrate mechanical and electromechanical components of micro-and nano sizes on a single silicon substrate using microfabrication techniques. MEMS industry is at the verge of transforming the semiconductor world into MEMS universe, apart from other hindrances; the reliability of these devices is the focal point of recent research. Commercialization is highly dependent on the reliability of these devices. MEMS requires a high level of reliability. Several technological factors, operating conditions, and environmental effects influencing the performances of MEMS devices must be completely understood. This study reviews some of the major reliability issues and failure mechanisms. Specifically, the fatigue in MEMS is a major material reliability issue resulting in structural damage, crack growth, and lifetime measurements of MEMS devices in the light of statistical distribution and fatigue implementation of Paris' law for fatigue crack accumulation under the influence of undesirable operating and environmental conditions.

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Mechanical characterization of MEMS materials

Cited by 5 publications

References 6 publications

Design and Fabrication of Piezoelectric Micromachined Ultrasound Transducer (pMUT) with Partially-Etched ZnO Film

Design and Fabrication of Piezoelectric Micromachined Ultrasound Transducer (pMUT) with Partially-Etched ZnO Film

Si-based MEMS resonant sensor: A review from microfabrication perspective

Reliability and Fatigue Analysis in Cantilever-Based MEMS Devices Operating in Harsh Environments

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