Reliability and Fatigue Analysis in Cantilever-Based MEMS Devices Operating in Harsh Environments

Jan, Mohammad Tariq; Hamid, Nor Hisham; Khir, M. H. Md; Ashraf, Khalid; Shoaib, Muhammad

doi:10.1155/2014/987847

Cited by 17 publications

(6 citation statements)

References 97 publications

(123 reference statements)

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“…Regarding the long-term stability of the devices presented here, a detailed investigation needs to be conducted in future work. However, the individual components are known to be highly reliable, such as AlN thin films [56] and polysilicon cantilevers [57]. Regarding the integrated micromagnets, it was demonstrated that during storage under ambient conditions for two years, no decrease in performance is observed [58].…”

Section: Discussionmentioning

confidence: 99%

Fully Integrated High-Performance MEMS Energy Harvester for Mechanical and Contactless Magnetic Excitation in Resonance and at Low Frequencies

Bodduluri¹,

Dankwort²,

Lisec³

et al. 2022

Micromachines

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Energy harvesting and storage is highly demanded to enhance the lifetime of autonomous systems, such as IoT sensor nodes, avoiding costly and time-consuming battery replacement. However, cost efficient and small-scale energy harvesting systems with reasonable power output are still subjects of current development. In this work, we present a mechanically and magnetically excitable MEMS vibrational piezoelectric energy harvester featuring wafer-level integrated rare-earth micromagnets. The latter enable harvesting of energy efficiently both in resonance and from low-g, low-frequency mechanical energy sources. Under rotational magnetic excitation at frequencies below 50 Hz, RMS power output up to 74.11 µW is demonstrated in frequency up-conversion. Magnetic excitation in resonance results in open-circuit voltages > 9 V and RMS power output up to 139.39 µW. For purely mechanical excitation, the powder-based integration process allows the realization of high-density and thus compact proof masses in the cantilever design. Accordingly, the device achieves 24.75 µW power output under mechanical excitation of 0.75 g at resonance. The ability to load a capacitance of 2.8 µF at 2.5 V within 30 s is demonstrated, facilitating a custom design low-power ASIC.

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Section: Discussionmentioning

confidence: 99%

Fully Integrated High-Performance MEMS Energy Harvester for Mechanical and Contactless Magnetic Excitation in Resonance and at Low Frequencies

Bodduluri¹,

Dankwort²,

Lisec³

et al. 2022

Micromachines

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show abstract

“…Tanner (2007) [17], Jacopo Iannacci (2014) [18], and Hu, Yi (2014) et al [19] discussed the reliability issue from the perspective of the product design process for manufacturing-level optimization. In 2014, Tariq Jan et al reviewed the reliability and fatigue problems of MEMS devices with cantilever beams in harsh environments [20]. In 2017, Rafiee et al [21] summarized the relationship found between the nonlinear effects exhibited by MEMS and its reliability.…”

Section: Scenarios Shock Loadmentioning

confidence: 99%

Reliability of MEMS in Shock Environments: 2000–2020

Peng

You

2021

Micromachines

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The reliability of MEMS in shock environments is a complex area which involves structural dynamics, fracture mechanics, and system reliability theory etc. With growth in the use of MEMS in automotive, IoT, aerospace and other harsh environments, there is a need for an in-depth understanding of the reliability of MEMS in shock environments. Despite the contributions of many articles that have overviewed the reliability of MEMS panoramically, a review paper that specifically focuses on the reliability research of MEMS in shock environments is, to date, absent. This paper reviews studies which examine the reliability of MEMS in shock environments from 2000 to 2020 in six sub-areas, which are: (i) response model of microstructure, (ii) shock experimental progresses, (iii) shock resistant microstructures, (iv) reliability quantification models of microstructure, (v) electronics-system-level reliability, and (vi) the coupling phenomenon of shock with other factors. This paper fills the gap around overviews of MEMS reliability in shock environments. Through the framework of these six sub-areas, we propose some directions potentially worthy of attention for future research.

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“…Fatigue, fracture, mechanical wear, shock, vibrations, and charging Effects of stiction and welding failure were performed at 10 9 on/off switching cycles [46,47].…”

Section: Micro Relaysmentioning

confidence: 99%

A Review on Key Issues and Challenges in Devices Level MEMS Testing

et al. 2016

Self Cite

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The present review provides information relevant to issues and challenges in MEMS testing techniques that are implemented to analyze the microelectromechanical systems (MEMS) behavior for specific application and operating conditions. MEMS devices are more complex and extremely diverse due to the immersion of multidomains. Their failure modes are distinctive under different circumstances. Therefore, testing of these systems at device level as well as at mass production level, that is, parallel testing, is becoming very challenging as compared to the IC test, because MEMS respond to electrical, physical, chemical, and optical stimuli. Currently, test systems developed for MEMS devices have to be customized due to their nondeterministic behavior and complexity. The accurate measurement of test systems for MEMS is difficult to quantify in the production phase. The complexity of the device to be tested required maturity in the test technique which increases the cost of test development; this practice is directly imposed on the device cost. This factor causes a delay in time-to-market.

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Reliability and Fatigue Analysis in Cantilever-Based MEMS Devices Operating in Harsh Environments

Cited by 17 publications

References 97 publications

Fully Integrated High-Performance MEMS Energy Harvester for Mechanical and Contactless Magnetic Excitation in Resonance and at Low Frequencies

Fully Integrated High-Performance MEMS Energy Harvester for Mechanical and Contactless Magnetic Excitation in Resonance and at Low Frequencies

Reliability of MEMS in Shock Environments: 2000–2020

A Review on Key Issues and Challenges in Devices Level MEMS Testing

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