2017
DOI: 10.5194/jsss-6-331-2017
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Measuring strain during a cylindrical grinding process using embedded sensors in a workpiece

Abstract: Abstract. This paper presents the results of using a sensor-integrated workpiece for in situ measurement of strain during an outer-diameter cylindrical grinding process. The motivation of this work is to measure in situ process parameters using integrated sensors in a workpiece in order to characterize the manufacturing process. Resistive sensors that operate on the same principle as conventional strain gauges were fabricated on wafers made of steel using standard microtechnology and later the wafers were dice… Show more

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Cited by 4 publications
(1 citation statement)
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“…Although external loads such as forces affecting the workpiece during material processing can be measured and analyzed in detail (e.g., with force dynamometers), there is currently no in-process measuring method that is capable of determining the strains in the contact zone. Steel integrated thin film sensors to measure the mechanical loads in test workpieces during the manufacturing process are subject of current scientific research [7][8][9]. However, this measurement approach is invasive and currently only allows single-point measurements with a limited spatial resolution in the millimeter range.…”
Section: Introductionmentioning
confidence: 99%
“…Although external loads such as forces affecting the workpiece during material processing can be measured and analyzed in detail (e.g., with force dynamometers), there is currently no in-process measuring method that is capable of determining the strains in the contact zone. Steel integrated thin film sensors to measure the mechanical loads in test workpieces during the manufacturing process are subject of current scientific research [7][8][9]. However, this measurement approach is invasive and currently only allows single-point measurements with a limited spatial resolution in the millimeter range.…”
Section: Introductionmentioning
confidence: 99%