Abstract:The question, how certain surface layer properties (for example, hardness or roughness) can be specifically influenced in different manufacturing processes, is of great economic interest. A prerequisite for the investigation of the formation of surface layer properties is the metrological assessment of the material stresses during processing. Up to now, no commercial in-process measuring system exists, which is able to determine material stresses in the form of mechanical strains in high-dynamic manufacturing processes with sufficient accuracy. A detailed analysis of the resolution limits shows that speckle photography enables deformation measurements with a resolution in the single-digit nanometer range. Thus, speckle photography basically offers the potential to measure material stresses during processing. Using the example of single-tooth milling, the applicability of speckle photography for in-process stress measurements is demonstrated. Even in such highly dynamic manufacturing processes with cutting speeds up to 10 m/s, the absolute measurement uncertainty of the strain is less than 0.05%. This is more than one order of magnitude lower than the occurring maximal strain. Therefore, speckle photography is suitable for characterizing the dynamic stresses and the material deformations in manufacturing processes.
Simulations of light scattering from nano-structured surface areas require substantial amount of computing time. The emergence of General Purpose Graphics Processing Units (GPGPUs) as affordable PC SIMD arithmetic coprocessors brings the necessary computing power to modern desktop PCs. In this paper we examine how the computation time of the Finite-Difference Time-Domain (FDTD), a classic numerical method for computing a solution to Maxwell's equations, can be reduced by leveraging the massively parallel architecture of GPGPUs cards. 2008 11th IEEE International Conference on Computational Science and Engineering 978-0-7695-3193-9/08 $25.00
The knowledge of the loads occurring during a manufacturing process (e.g., grinding) and of the modifications remaining in the material is used in the concept of process signatures to optimize the manufacturing process and compare it with others (e.g., laser processing). The prerequisite for creating a process signature is that the loads can be characterized during the running process. Due to the rough process conditions, until now there is no in-process technique to measure the loads in the form of displacements and strains in the machined boundary zone. For this reason, the suitability of speckle photography is demonstrated for in-process measurements of material loads in a grinding process without cooling lubricant and the measurement results are compared with finite element method (FEM) simulations. As working hypothesis for the simulation it is assumed, that dry grinding is a purely thermally driven process. Despite the approximation by a purely thermal model with a constant heat source, the measured displacements differ only by a maximum of approximately 20% from the simulations. In particular, the strain measurements in feed speed direction are in good agreement with the simulation and support the thesis, that the dry grinding conditions used here lead to a primarily thermally affecting process.
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