Measurement of IC Molding Compound Adhesion Strength and Prediction of Interface Delamination Within Package.

Tanaka, Nobuatsu; Nishimura, A.

doi:10.1299/kikaia.60.1992

Cited by 19 publications

(19 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…We previously indicated that the smaller initial crack length gives a higher [9]. It is, however, meaningless for the practical purpose to discuss the occurrence of extremely small delamination below the experimentally detectable limit; besides, there is little difference between the value of for the initial crack length of 0.2 mm and that obtained by extrapolating the relation curve between the and the initial crack length to the crack length zero [9]. The presence analysis with the initial crack length of 0.2 mm is therefore thought to have sufficient accuracy for practical use.…”

Section: B Prediction Of Interface Delamination In Moisturized Ic Pamentioning

confidence: 99%

“…The delamination occurrence temperature drops sharply when the moisture absorption temperature is high. We previously clarified that the interface delamination in moisture-absorbed packages during reflow soldering is mainly governed by thermal stress not by vapor pressure [9]. This means that the change in delamination occurrence temperature in the packages corresponds to the change in true adhesion strength due to moisture absorption.…”

Section: B Measurement Of Interface Delamination In Moisturized Ic Pmentioning

confidence: 99%

“…The analysis results of and in a moisturized package at delamination occurrence temperature are listed in Table III. Two-dimensional (2-D) thermal-stress analysis was carried out by using the package analysis model assuming an initial interface crack whose length is 0.2 mm along the die pad edge [9], and the stress intensity factor was calculated from the obtained stress distribution in front of the tip of the initial interface crack. We previously indicated that the smaller initial crack length gives a higher [9].…”

Section: B Prediction Of Interface Delamination In Moisturized Ic Pamentioning

confidence: 99%

“…Two-dimensional (2-D) thermal-stress analysis was carried out by using the package analysis model assuming an initial interface crack whose length is 0.2 mm along the die pad edge [9], and the stress intensity factor was calculated from the obtained stress distribution in front of the tip of the initial interface crack. We previously indicated that the smaller initial crack length gives a higher [9]. It is, however, meaningless for the practical purpose to discuss the occurrence of extremely small delamination below the experimentally detectable limit; besides, there is little difference between the value of for the initial crack length of 0.2 mm and that obtained by extrapolating the relation curve between the and the initial crack length to the crack length zero [9].…”

Section: B Prediction Of Interface Delamination In Moisturized Ic Pamentioning

confidence: 99%

“…We previously developed a new adhesion test method for obtaining "true" adhesion strength which is not affected by residual stress [6], and we also developed an evaluation approach that can predict interface delamination in dry IC packages [9]. The purpose of the present study is to extend this approach to the quantitative prediction of interface delamination in moisture-absorbed IC packages.…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling

Tanaka

Kitano

Kumazawa

et al. 1999

IEEE Trans. Comp. Packag. Technol.

View full text Add to dashboard Cite

We have determined the influence of moisture soaking conditions on true adhesion strength measured by our previously developed method. The drop in true adhesion strength of a specimen that absorbed moisture at 50 C is about 50% less than that of a specimen at 85 C. This result suggests that the true adhesion strength depends on not only the moisture content but also the moisture absorption temperature. Therefore, we think that the general moisture condition (85 C/85%) causes more damage to plastic integrated circuit (IC) packages than that of moisture absorption at room temperature. We also evaluated interface delamination in a moisture-absorbed package by considering the swelling of the molding compound due to moisture absorption. The predicted interface delamination agrees well with the experimental data for moisture-soaked packages.

show abstract

Section: B Prediction Of Interface Delamination In Moisturized Ic Pamentioning

confidence: 99%

Section: B Measurement Of Interface Delamination In Moisturized Ic Pmentioning

confidence: 99%

Section: B Prediction Of Interface Delamination In Moisturized Ic Pamentioning

confidence: 99%

Section: B Prediction Of Interface Delamination In Moisturized Ic Pamentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling

Tanaka

Kitano

Kumazawa

et al. 1999

IEEE Trans. Comp. Packag. Technol.

View full text Add to dashboard Cite

show abstract

Characterization and Modelling of Moisture Behaviour

Fan¹,

Zhang

Driel

et al. 2006

Solid Mechanics and Its Applications

View full text Add to dashboard Cite

Influence of temperature, humidity, and defect location on delamination in plastic IC packages

Tay

Lin²

1999

IEEE Trans. Comp. Packag. Technol.

View full text Add to dashboard Cite

The modified J-integral and the stress intensity factor based on linear elastic fracture mechanics can be applied to predict the growth of interfacial delamination in integrated circuit (IC) packages. One of the key parameters required is the interfacial fracture toughness. This paper describes the measurement of the interfacial fracture toughness as a function of temperature and relative humidity using a three-point bending test. The interfacial fracture toughness was found to decrease with temperature and relative humidity. It is proposed that delaminations propagate from very small voids or defects present at the interface. The effect of the location of these interfacial defects or cracks on delamination was studied. The IC package evaluated in this paper was an 80-pin quad flat package with a 0.2 mm defect or crack at the edge or at the center of the interface. It was found that as the temperature of the package was increased, the stress intensity factor of the edge crack was higher than that of the center crack. However, whether the edge crack will propagate first as temperature is increased depends on the ratio of mode II interface toughness to that of the mode I interface toughness.. For the package under investigation, it was established that when this ratio is less than 2.69 the edge crack would propagate first, otherwise the center crack would. For small defects, it was found that the water vapor pressure developed at the interface did not have a significant effect on the value of the crack-tip stress intensity factor.

show abstract

Measurement of IC Molding Compound Adhesion Strength and Prediction of Interface Delamination Within Package.

Cited by 19 publications

References 0 publications

Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling

Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling

Characterization and Modelling of Moisture Behaviour

Influence of temperature, humidity, and defect location on delamination in plastic IC packages

Contact Info

Product

Resources

About