Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling

Abstract

We have determined the influence of moisture soaking conditions on true adhesion strength measured by our previously developed method. The drop in true adhesion strength of a specimen that absorbed moisture at 50 C is about 50% less than that of a specimen at 85 C. This result suggests that the true adhesion strength depends on not only the moisture content but also the moisture absorption temperature. Therefore, we think that the general moisture condition (85 C/85%) causes more damage to plastic integrated circuit (IC) packages than that of moisture absorption at room temperature. We also evaluated interface delamination in a moisture-absorbed package by considering the swelling of the molding compound due to moisture absorption. The predicted interface delamination agrees well with the experimental data for moisture-soaked packages.

High temperature humidity sensors based on sputtered Y-doped BaZrO3 thin films

“…Most solid-state humidity sensors based on chemisorp- tion of H 2 O lack selectivity and are not functional at high temperatures [31][32][33][34]. Y-doped BaZrO 3 can exhibit oxygen vacancies when doped with a lower valence ion e.g., Y 3+ on the Zr 4+ .…”

An improved miniature mixed-mode delamination setup for in situ microscopic interface failure analyses

“…1(c)). Specifically, delamination of copper lead frame (CuLF)-MCE interfaces attracted significant attention from researchers [3][4][5][6][7][8][9]. Yet the behavior of this interface over the full range of mode mixities and the underlying delamination mechanism are still not well understood.…”

Interface delamination analysis of TQFP package during solder reflow

“…The residual stress at the interface in the encapsulated package is induced due to the CTE mismatch [42] and the cure shrinkage of EMC [43] when it is cooled down from molding temperature to room temperature. Furthermore, it seems that the interface adhesion is a function of exposure time to moisture and the adhesion strength decreases as the moisture content increases [44,45]. Finally, the moisture diffusion coefficient at the EMC/leadframe interface is larger (almost one order magnitude) than that in the bulk EMC which may be due to the large pore sizes at the EMC/ leadframe interface than those within the bulk EMC and also capillary diffusion along the EMC/leadframe interface [46,47].…”