No abstract

The development of organic printed electronics has been expanding to a variety of applications and is expected to bring innovations to our future life. Along with this trend, high performance organic materials with cost-efficient fabrication processes and specific features such as thin, light weight, bendable, and low power consumption are required. A variety of organic materials have been investigated in the development of this field. The basic guidelines for material design and the recent progress of polymer-based organic light-emitting diodes (OLEDs) and organic photovoltaic cells (OPVs) are reported.

Complexes of bis(hexafluoroacetylacetonato)copper(II) [Cu(hfac)(2)] ligated with 3- and 4-(N-oxyl-tert-butylamino)pyridines (3NOPy and 4NOPy) and N-{3- and 4-(N-oxyl-tert-butylamino)phenyl}imidazoles (3NOIm and 4NOIm) were prepared. The 1:2 complexes [Cu(hfac)(2)(3NOPy and 4NOPy)(2)] have hexacoordinated octahedral structures in which the two pyridyl nitrogen atoms are coordinated to the copper(II) ions in the trans configuration. The 1:1 complex [Cu(hfac)(2)(4NOPy)] has a distorted pentacoordinated pseudo-head-to-tail cyclic dimer structure in which the oxygen atom of the aminoxyl group of one complex is situated at a distance of 2.79 Å from the copper ion of the other complex. The magnetic properties of these and two other complexes, [Cu(hfac)(2)(3NOIm and 4NOIm)(2)], were investigated using a SQUID susceptometer. Temperature dependence studies of the chi(mol)Tvalues of [Cu(hfac)(2)(4NOPy)(2)] revealed that the two aminoxyl radicals interact ferromagnetically with the copper(II) ion (S = (1)/(2)) with an exchange parameter J/k(B) = 60.4 +/- 3.3 K to produce a quartet ground state (S = (3)/(2)). On the other hand, the chi(mol)T value of the isomeric [Cu(hfac)(2)(3NOPy)(2)] was nearly constant at 0.5 emu K mol(-)(1) in the temperature range 5-300 K. A rectangular four-spin model was fitted to the chi(mol)T vs T plot for complex [Cu(hfac)(2)(4NOPy)] to give J/k(B) = 58.6 and 58.5 K. Similarly, the J values for [Cu(hfac)(2)(3NOIm and 4NOIm)(2)] were negative and positive, respectively, but their absolute J values were too small to determine in both cases.

Surface munt packages are heated up above solder melt ing temperature during reflow soldering process. If t h e p l a s t i c e n c a p s u l a n t h a s absorbed m o i s t u r e , package cracking may occur. In t h i s study, an evaluat i o n method of Lhe package cracking is developed by means of moisture diffusion analysis of p l a s t i c and deformation and s t r e s s analysis of packages.