2018
DOI: 10.1016/j.addma.2018.02.019
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Measurement of anisotropic thermal conductivity and inter-layer thermal contact resistance in polymer fused deposition modeling (FDM)

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Cited by 56 publications
(50 citation statements)
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“…Recently, 3D printing has been widely used to construct various complex structures in thermal conductive devices. [65][66][67] Thermal conductive fillers, such as grapheme nanoplatelet (GNPs), CNTs, boron nitride (BN), etc., are incorporated into the polymer matrix to enhance the thermal conductivity, and the wellconnected filler network facilitates the heat conduction of the printed parts. 43,68 There are two main approaches to improve the thermal conductivity of the 3D printed parts.…”
Section: D Printing For Thermal Conductive Devicesmentioning
confidence: 99%
“…Recently, 3D printing has been widely used to construct various complex structures in thermal conductive devices. [65][66][67] Thermal conductive fillers, such as grapheme nanoplatelet (GNPs), CNTs, boron nitride (BN), etc., are incorporated into the polymer matrix to enhance the thermal conductivity, and the wellconnected filler network facilitates the heat conduction of the printed parts. 43,68 There are two main approaches to improve the thermal conductivity of the 3D printed parts.…”
Section: D Printing For Thermal Conductive Devicesmentioning
confidence: 99%
“…The layerwise printing process creates a meso-structure with anisotropic physical properties, which gives rise to metamaterials. The anisotropic properties have been studied for the mechanical [ 29 , 30 , 31 ], thermal [ 32 , 33 ], magnetic [ 34 ], and electrical [ 35 ] domains. The anisotropy in the electrical properties can be explained by means of interfacial and inter-layer contact resistance, which is believed to originate from imperfect bonding conditions (e.g.…”
Section: Introductionmentioning
confidence: 99%
“…Owing to their popularity, the polymer-based AM manufacturing processes such as FFF have been extensively studied for a variety of applications [3,10]. However, the parts printed using FFF have reduced mechanical [11][12][13] and thermal properties [14] required in most end-use applications, and thus are not preferred in such engineering applications. The inter-laminar bonding in FFF parts largely affects their mechanical properties.…”
Section: Introductionmentioning
confidence: 99%