Measured thermal images of a gallium arsenide power MMIC with and without RF applied to the input

Oxley, C. H.; Coaker, B.M.; Priestley, N.

doi:10.1016/s0038-1101(02)00356-8

Cited by 6 publications

(2 citation statements)

References 1 publication

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“…Measurements made using AFM have achieved sub micrometer resolutions [21], although surface topology can give rise to some measurement error. For large area two-dimensional surface temperature mapping, IR thermal microscopy can be used [22]. Infrared thermal microscopy is a non-contact technique, utilizing naturally emitted infrared radiation from a sample, resulting in a real time thermal image.…”

Section: Hemt Device Structure Under Studymentioning

confidence: 99%

Thermal Analysis of AlGaN/GaN HEMT: Measurement and Analytical Modeling Techniques

Raj¹,

Bindra²

2013

IJCA

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In this paper, the temperature dependent electrical measurements by employing a Quantum Focus Instrument (QFI) and analytical analysis were presented and applied to Aluminum Gallium Nitride, Gallium Nitride (AlGaN-GaN) High Electron-Mobility Transistors (HEMTs). The analytical evaluation of band bap energy, electron mobility, thermal conductivity and thermal resistance has been carried out. The electrical measurements have been done using network analyzer with infrared IR measurement technology. The results obtained on the basis of electrical measurements are compared with analytical and simulated results for the purpose of validation of our outcomes. The measured data shows a good agreement with analytical and simulated results, thereby validating our approach of AlGaN/GaN HEMT analysis.

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Section: Hemt Device Structure Under Studymentioning

confidence: 99%

Thermal Analysis of AlGaN/GaN HEMT: Measurement and Analytical Modeling Techniques

Raj¹,

Bindra²

2013

IJCA

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“…From the failure perspective the temperature is active factor for most failure models, so temperature reduction will significantly improve the expected reliability of MCMs [2]. High operating temperatures can also reduce the RF (radiofrequency range) MCM performance [3], [4].…”

Section: Introductionmentioning

confidence: 99%

Thermal Analysis of MCM Packaging

Andonova

2014

ElAEE

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This paper describes the use of infra-red thermography for the thermal study in the development stage of custom enclosures for multi-chip modules. Some limitations of conventional thermographic measurements are discussed and an approach for enhancing its application to quality control and diagnostics of faulty multi-chip module packages is proposed. The results from thermal measurements of radiofrequency range multi-chip module prototype in an open and a closed Quad Flat No Lead package are presented.

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Low-temperature co-fired ceramic-based thermoelectric generator with cylindrical grooves for harvesting waste heat from power circuits

Jaziri

Müller

et al. 2021

Applied Thermal Engineering

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Measured thermal images of a gallium arsenide power MMIC with and without RF applied to the input

Cited by 6 publications

References 1 publication

Thermal Analysis of AlGaN/GaN HEMT: Measurement and Analytical Modeling Techniques

Thermal Analysis of AlGaN/GaN HEMT: Measurement and Analytical Modeling Techniques

Thermal Analysis of MCM Packaging

Low-temperature co-fired ceramic-based thermoelectric generator with cylindrical grooves for harvesting waste heat from power circuits

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