Thermal Analysis of MCM Packaging

Abstract

This paper describes the use of infra-red thermography for the thermal study in the development stage of custom enclosures for multi-chip modules. Some limitations of conventional thermographic measurements are discussed and an approach for enhancing its application to quality control and diagnostics of faulty multi-chip module packages is proposed. The results from thermal measurements of radiofrequency range multi-chip module prototype in an open and a closed Quad Flat No Lead package are presented.