Non-destructive Thermal Diagnostics of Multilayer Substrates for Multichip Modules

Stoynova, Anna; Bonev, Borislav; Andreev, Svetozar; Spasova, Nina

doi:10.1109/eptc53413.2021.9663919

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) 2021

DOI: 10.1109/eptc53413.2021.9663919

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Non-destructive Thermal Diagnostics of Multilayer Substrates for Multichip Modules

Anna Stoynova

Borislav Bonev

Svetozar Andreev

et al.

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2022

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Post-processing Improvement of Lock-in Thermography Study of MCM-L for Better Hidden Defect Localization

Stoynova

Bonev

2022

International Journal of Circuits, Systems and Signal Processing

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This paper examines the impact of post-processing of lock-in thermographic measurement data on the ability to detect and characterize in terms of geometric dimensions and location of specific types of defects in MCM-L. A thermal 3D model of a test specimen with hidden artificial defects is used and simulated lock-in thermography measurement is performed. Qualitative and quantitative assessment was performed of the correct detection and geometric dimensions characterization of the defects. The Shape Difference (SD) criteria was defined and used for qualitative and quantitative assessment of the confidence detection and characterization of defects in MCM-L. A Window Sliding Offset (WSO) approach is performed as method for improvement of the defects characterization quality. This study revel that providing information on the depth and shape of defects through the combined use of infrared thermography measurement and 3D thermal modeling can be used to determine the desired confidence levels of defects detection.

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Post-processing Improvement of Lock-in Thermography Study of MCM-L for Better Hidden Defect Localization

Stoynova

Bonev

2022

International Journal of Circuits, Systems and Signal Processing

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Active Thermography Diagnostics of Hidden Defects in Multilayer FR-4 Substrates

Stoynova

Bonev

2022

International Journal of Circuits, Systems and Signal Processing

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This paper discusses the applicability of pulsed and lock-in thermography using Fourier transform processing to diagnose specific types of defects in Multilayer FR-4 Substrates. Digital thermal models of test specimens with different types of defects have been created. Based on the obtained results, the methods are compared in terms of applicability and reliability in defect detection. The results show that by these methods can be detected and characterized in terms of geometric dimensions and type of certain types of specific defects arising in the production of FR-4 multilayer substrates. The presented results show that there is no obstacle to the detection of defects in different layers of the multilayer substrate within the same measurement, as well as the possibility of detecting many types of defects.

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Non-destructive Thermal Diagnostics of Multilayer Substrates for Multichip Modules

Cited by 2 publications

References 4 publications

Post-processing Improvement of Lock-in Thermography Study of MCM-L for Better Hidden Defect Localization

Post-processing Improvement of Lock-in Thermography Study of MCM-L for Better Hidden Defect Localization

Active Thermography Diagnostics of Hidden Defects in Multilayer FR-4 Substrates

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