Material Interaction Effects in the Reliability of High Density Interconnect (HDI) Boards

Mahalingam, Saketh; Hegde, S.; Ramakrishna, Gnyaneshwar; Pucha, Raghuram V.; Sitaraman, Suresh K.

doi:10.1115/imece2003-41645

Cited by 4 publications

(2 citation statements)

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“…However, the low modulus of the polymer dielectric helps keep the stress low for most parts of the fabrication process. The effects of the dielectric and substrate properties on stresses and warpage have been reported [60]. The elastic modulus and CTE of polymer dielectrics have the most-pronounced effect on the stresses and on RDL reliability.…”

Section: Residual Stresses and Warpagementioning

confidence: 99%

A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates

Nimbalkar,

Bhaskar,

Kathaperumal

et al. 2023

Polymers

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The ever-increasing demand for faster computing has led us to an era of heterogeneous integration, where interposers and package substrates have become essential components for further performance scaling. High-bandwidth connections are needed for faster communication between logic and memory dies. There are several limitations to current generation technologies, and dielectric buildup layers are a key part of addressing those issues. Although there are several polymer dielectrics available commercially, there are numerous challenges associated with incorporating them into interposers or package substrates. This article reviewed the properties of polymer dielectric materials currently available, their properties, and the challenges associated with their fabrication, electrical performance, mechanical reliability, and electrical reliability. The current state-of-the-art is discussed, and guidelines are provided for polymer dielectrics for the next-generation interposers.

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Section: Residual Stresses and Warpagementioning

confidence: 99%

A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates

Nimbalkar,

Bhaskar,

Kathaperumal

et al. 2023

Polymers

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“…7(a)] and material interaction effects [ Fig. 7(b)] in developing predictive models and up-front design guidelines for SOP system board fabrication [18], [19].…”

Section: ) Digital Function Reliability: Upfront Process Optimizatiomentioning

confidence: 99%

System-Level Reliability Assessment of Mixed-Signal Convergent Microsystems

Pucha

Hegde

Damani

et al. 2004

IEEE Trans. Adv. Packag.

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The next-generation convergent microsystems, based on system-on-package (SOP) technology, require up-front system-level design-for-reliability approaches and appropriate reliability assessment methodologies to guarantee the reliability of digital, optical, and radio frequency (RF) functions, as well as their interfaces. Systems approach to reliability requires the development of: i) physics-based reliability models for various failure mechanisms associated with digital, optical, and RF Functions, and their interfaces in the system; ii) design optimization models for the selection of suitable materials and processing conditions for reliability, as well as functionality; and iii) system-level reliability models understanding the component and functional interaction. This paper presents the reliability assessment of digital, optical, and RF functions in SOP-based microsystems. Upfront physics-based design-for-reliability models for various functional failure mechanisms are presented to evaluate various design options and material selection even before the prototypes are made. Advanced modeling methodologies and algorithms to accommodate material length scale effects due to enhanced system integration and miniaturization are presented. System-level mixed-signal reliability is discussed thorough system-level reliability metrics relating component-level failure mechanisms to system-level signal integrity, as well as statistical aspects.

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