System-Level Reliability Assessment of Mixed-Signal Convergent Microsystems

Abstract

The next-generation convergent microsystems, based on system-on-package (SOP) technology, require up-front system-level design-for-reliability approaches and appropriate reliability assessment methodologies to guarantee the reliability of digital, optical, and radio frequency (RF) functions, as well as their interfaces. Systems approach to reliability requires the development of: i) physics-based reliability models for various failure mechanisms associated with digital, optical, and RF Functions, and their interfaces in the system; ii) design optimization models for the selection of suitable materials and processing conditions for reliability, as well as functionality; and iii) system-level reliability models understanding the component and functional interaction. This paper presents the reliability assessment of digital, optical, and RF functions in SOP-based microsystems. Upfront physics-based design-for-reliability models for various functional failure mechanisms are presented to evaluate various design options and material selection even before the prototypes are made. Advanced modeling methodologies and algorithms to accommodate material length scale effects due to enhanced system integration and miniaturization are presented. System-level mixed-signal reliability is discussed thorough system-level reliability metrics relating component-level failure mechanisms to system-level signal integrity, as well as statistical aspects.

Development of Reliability Allocation and Assessment Algorithms for Designing Multilevel Microelectronic Systems

“…This work aims to present an integrated method and its algorithms for designing microelectronic systems for reliability using both statistics and physics-of-failure knowledge [17][18][19] in a scope ranging from random failures to wear-out failures, from system structure to failure modes, and from reliability allocation to design recommendations.…”

System-Design-for-Reliability Tools for Highly Integrated Electronic Packaging Systems

“…A System Design-for-Reliability (SDfR) is a method for designing subsystems, selecting components, and designing interconnections to achieve targeted system reliability in a given context. Designing highly integrated complex systems that satisfy target reliability is a challenge because of complex assembly structures and logical connections, numerous components and associated failure modes [1], limited reliability data or prediction models, and multi-disciplinary considerations. Currently there are no established approaches to address the elements and activities of SDfR and the challenges associated with it.…”

Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates

“…Trends in packaging technologies are leading to the integration of novel materials and processes in highly integrated technologies such as system-onpackage (SOP) with embedded functional components. The high dielectric constant materials needed for decoupling capacitors in SOP functional substrates typically consist of inorganic-organic nano-composites or pure inorganic films [1]- [4] and should have good adhesion with the underlying metal electrodes and compatible thermomechanical properties [5]. The high filler content required with nano-composite approach affects the adhesion between the capacitor film and metal and hence limits the reliability.…”