This paper reports on recent progress in infrared detection modules that integrate infrared photodetectors, signal processing electronics, optics, heat dissipation systems, and other components in common packages. The integration makes detectors less vulnerable to over-bias, electrostatic discharges, electromagnetic interferences, and other environmental exposures. Additional advantages of integration are improved HF performance, output signal standardization, miniaturization, and cost reduction. Examples are given of detection modules with an infrared detector optimized for uncooled or Peltier-cooled operation in the spectral range of 2 to 16 μm. The paper is mainly based on the authors' experience in the development and fabrication of detection modules at Vigo System S.A.