&lt;title&gt;Automated assembly of micro-optical components&lt;/title&gt;

Eberhardt, Ramona; Scheller, Torsten; Tittelbach, Guenther; Guyenot, Volker

doi:10.1117/12.298029

Cited by 13 publications

(6 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Assuming that scaling occurs uniformly in all three dimensions, the stiffness of a flexure, k, scales linearly L L inertia of moment k 3 _ _ ( 5 ) The contact force due to the deformation in the compliant springs of the connectors scales accordingly 2 L kL F c ( 6 ) The friction between the contact areas, f, has the same dependence on the scale 2 L F f c ( 7 ) Angular alignment error, , as shown in Eq. 4, is independent of the scale.…”

Section: Scalabilitymentioning

confidence: 99%

“…Systems that significantly benefit from the integration of heterogeneous devices include those in the RF/microwave, optical, and bio-sensing arenas [1][2][3][4][5][6][7][8][9]. For example, RF transceiver architectures rely on off-chip passives to achieve the high quality factors demanded by many applications, optical systems and sub-systems are comprised of lenses, filters and active components, and some bio-sensors capable of detecting and transducing a wide variety of in vivo changes into electrical signals are best made by assembling sensors to microelectronic circuitry [7][8][9].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

3-D, Self-aligned, Micro-assembled, Electrical Interconnects for Heterogeneous Integration

et al. 2003

View full text Add to dashboard Cite

It is of great interest to develop an efficient and reliable manufacturing approach that allows for the integration of microdevices each of which is optimally fabricated using a different process. We present a new method to achieve electrical and mechanical interconnects for use in heterogeneous integration. This method combines metal reflow and a self-aligned, 3-D microassembly approach. The results obtained so far include a self-aligned, 3-D assembly of MEMS to MEMS, post-processing which selectively deposited indium on 50 m-thick MEMS structures, and reflow tests of indium-on-gold samples demonstrating 15-45 m resistances for contact areas ranging from 100 to 625 m 2 . 3-D microassembly coupled with metal reflow allows for the batch processing of a large number of heterogeneous devices into one system without sacrificing performance. In addition, its 3-D nature adds a new degree of freedom in system design space. Downward scalability of the method is also discussed.

show abstract

Section: Scalabilitymentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

3-D, Self-aligned, Micro-assembled, Electrical Interconnects for Heterogeneous Integration

et al. 2003

View full text Add to dashboard Cite

show abstract

“…(a) The relevant assembly process and technique for microstructure assembly have obtained the substantial development, including the gripping, handling, positioning, and bonding of parts with dimensions between a few and several hundred micrometers. [3][4][5] In addition, semi-automated assembly systems with vision and force feedback have been developed. [6][7][8][9][10] These assembly systems are characterized by low automation and low measuring precision.…”

Section: Introductionmentioning

confidence: 99%

Robotic precision assembly system for microstructures

Shao

Qian

et al. 2019

Proceedings of the Institution of Mechanical Engineers, Part I:

View full text Add to dashboard Cite

This article proposes a robotic precision assembly system for the typical parts of microstructures such as non-silicon microelectromechanical system parts. The assembly system contains three parallel assembly units and support system. In each unit, the images of the base part and target part can be obtained simultaneously from the coaxial alignment vision detection module. This article proposes a system calibration method to ensure accuracy of assembly system. Assembly experiments and accuracy validation tests are conducted. The experimental results show that the synthesizing assembly accuracy of the robotic precision assembly system can reach higher than 3 µm and the mean assembly cycle time of each part is less than 20 s, including the time for feeding and unloading parts. The robotic precision assembly system with nondestructive imaging and gripping can save on cost, achieve better quality results in less time, and greatly facilitate the precision assembly reliability and automation of microstructures.

show abstract

“…The application of an exact amount of adhesive is vital for joining of sophisticated components such as lenses for endoscopes, diode lasers or optical transmission systems [4,5,10,11]. Experiments indicate that enclosed air bubbles within the dosing unit due to the filling process have an adverse effect on the applied adhesive volume.…”

Section: Introductionmentioning

confidence: 99%

Study of factors influencing the microdosing of unfilled adhesives

Dilthey¹,

Brandenburg²,

Möller³

2001

J. Micromech. Microeng.

View full text Add to dashboard Cite

Adhesive bonding is a versatile joining technique which, until now however, has found use only to a small extent in microsystems technology. The reason for this is particularly the absence of techniques for dosing extremely small amounts of adhesive.The present paper describes two main problems encountered in the dosing of adhesives in volumes below 5.0 × 10 −11 m 3 (50 nl). On the one hand, the enclosing of air bubbles within the dosing unit affects the displaced amount of adhesive and, on the other hand, the displaced amount of adhesive could be different from the applied amount due to wetting influences.

show abstract

<title>Automated assembly of micro-optical components</title>

Cited by 13 publications

References 0 publications

3-D, Self-aligned, Micro-assembled, Electrical Interconnects for Heterogeneous Integration

3-D, Self-aligned, Micro-assembled, Electrical Interconnects for Heterogeneous Integration

Robotic precision assembly system for microstructures

Study of factors influencing the microdosing of unfilled adhesives

Contact Info

Product

Resources

About