Study of factors influencing the microdosing of unfilled adhesives

Abstract

Adhesive bonding is a versatile joining technique which, until now however, has found use only to a small extent in microsystems technology. The reason for this is particularly the absence of techniques for dosing extremely small amounts of adhesive.The present paper describes two main problems encountered in the dosing of adhesives in volumes below 5.0 × 10 −11 m 3 (50 nl). On the one hand, the enclosing of air bubbles within the dosing unit affects the displaced amount of adhesive and, on the other hand, the displaced amount of adhesive could be different from the applied amount due to wetting influences.