Abstract:The wide range of cryogenic applications, such as spatial, high performance computing or high-energy physics, has boosted the investigation of CMOS technology performance down to cryogenic temperatures. In particular, the readout electronics of quantum computers operating at low temperature requires larger bandwidth than spatial applications, so that advanced CMOS node has to be considered. FDSOI technology appears as a valuable solution for co-integration between qubits and consistent engineering of control a… Show more
“…It should be mentioned that the effective mobility 𝜇 𝑒 𝑓 𝑓 deduced from this local mobility law 𝜇 of Eq. (2c) exhibits variation with temperature in agreement with experimental data obtained on FDSOI MOSFETs [20,21].…”
Section: Electro-thermal Transport Equationssupporting
confidence: 87%
“…Note that the latter effect is disabled in long channel case. The low field empirical mobility law 𝜇 0 (𝑇) describes the mobility increase with temperature reduction governed by phonon scattering and for mobility saturation at low temperature due to prevailing defective scattering [2,20]. It should be mentioned that the effective mobility 𝜇 𝑒 𝑓 𝑓 deduced from this local mobility law 𝜇 of Eq.…”
Section: Electro-thermal Transport Equationsmentioning
Self-heating (SHE) TCAD numerical simulations have been performed, for the first time, on 30nm FDSOI MOS transistors at extremely low temperatures. The self-heating temperature rise 𝑑𝑇 𝑚𝑎𝑥 and the thermal resistance 𝑅 𝑡 ℎ are computed as functions of the ambient temperature 𝑇 𝑎 and the dissipated electrical power (𝑃 𝑑 ), considering calibrated silicon and oxide thermal conductivities. The characteristics of the SHE temperature rise 𝑑𝑇 𝑚𝑎𝑥 (𝑃 𝑑 ) display sub-linear behavior at sufficiently high levels of dissipated power, in line with standard FDSOI SHE experimental data. It has been observed that the SHE temperature rise 𝑑𝑇 𝑚𝑎𝑥 can significantly exceed the ambient temperature more easily at very low temperatures. Furthermore, a detailed thermal analysis of the primary heat flows in the FDSOI device has been conducted, leading to the development of an analytical SHE model calibrated against TCAD simulation data. This SHE analytical model accurately describes the 𝑑𝑇 𝑚𝑎𝑥 (𝑃 𝑑 ) and 𝑅 𝑡 ℎ (𝑇 𝑎 ) characteristics of an FDSOI MOS device operating at extreme low ambient temperatures. These TCAD simulations and analytical models hold great promise for predicting the SHE and electro-thermal performance of FDSOI MOS transistors against ambient temperature and dissipated power.
“…It should be mentioned that the effective mobility 𝜇 𝑒 𝑓 𝑓 deduced from this local mobility law 𝜇 of Eq. (2c) exhibits variation with temperature in agreement with experimental data obtained on FDSOI MOSFETs [20,21].…”
Section: Electro-thermal Transport Equationssupporting
confidence: 87%
“…Note that the latter effect is disabled in long channel case. The low field empirical mobility law 𝜇 0 (𝑇) describes the mobility increase with temperature reduction governed by phonon scattering and for mobility saturation at low temperature due to prevailing defective scattering [2,20]. It should be mentioned that the effective mobility 𝜇 𝑒 𝑓 𝑓 deduced from this local mobility law 𝜇 of Eq.…”
Section: Electro-thermal Transport Equationsmentioning
Self-heating (SHE) TCAD numerical simulations have been performed, for the first time, on 30nm FDSOI MOS transistors at extremely low temperatures. The self-heating temperature rise 𝑑𝑇 𝑚𝑎𝑥 and the thermal resistance 𝑅 𝑡 ℎ are computed as functions of the ambient temperature 𝑇 𝑎 and the dissipated electrical power (𝑃 𝑑 ), considering calibrated silicon and oxide thermal conductivities. The characteristics of the SHE temperature rise 𝑑𝑇 𝑚𝑎𝑥 (𝑃 𝑑 ) display sub-linear behavior at sufficiently high levels of dissipated power, in line with standard FDSOI SHE experimental data. It has been observed that the SHE temperature rise 𝑑𝑇 𝑚𝑎𝑥 can significantly exceed the ambient temperature more easily at very low temperatures. Furthermore, a detailed thermal analysis of the primary heat flows in the FDSOI device has been conducted, leading to the development of an analytical SHE model calibrated against TCAD simulation data. This SHE analytical model accurately describes the 𝑑𝑇 𝑚𝑎𝑥 (𝑃 𝑑 ) and 𝑅 𝑡 ℎ (𝑇 𝑎 ) characteristics of an FDSOI MOS device operating at extreme low ambient temperatures. These TCAD simulations and analytical models hold great promise for predicting the SHE and electro-thermal performance of FDSOI MOS transistors against ambient temperature and dissipated power.
“…In the case of CMOS sensors, another related challenge for deep-cryogenic operation is the usability of electronics in these devices at sub-Kelvin temperatures. The detailed properties of the electronics depend on target applications, and circuits designed to operate above 100 K may not perform well below 1 K. Numerous studies in the literature have been focusing on characterizing CMOS electronics designed for operation at around 4 K, and CMOS control and readout devices have been built to operate at these temperatures in quantum computing applications [41][42][43][44][45][46][47][48][49][50][51][52][53][54][55][56][57][58], or recently even as low as ∼ 0.05 K for use with quantum dots [59]. It would be instructive for the future experimental studies of the detector proposed in this paper to test simple CMOS circuits designed for operation at 4 K at the lower temperatures of the cold plate and the still flange.…”
Recent studies in quantum computing have shown that quantum
error correction with large numbers of physical qubits are limited
by ionizing radiation from high-energy particles. Depending on the
physical setup of the quantum processor, the contribution of muons
from cosmic sources can constitute a significant fraction of these
interactions. As most of these muons are difficult to stop, we
perform a conceptual study of a two-layer silicon pixel detector to
tag their hits on a solid-state quantum processor instead. With a
typical dilution refrigerator geometry model, we find that
efficiencies greater than 50% are most likely to be achieved if at
least one of the layers is operated at the deep-cryogenic (<1 K)
flanges of the refrigerator. Following this finding, we further
propose a novel research program that could allow the development of
silicon pixel detectors that are fast enough to provide input to
quantum error correction algorithms, can operate at deep-cryogenic
temperatures, and have very low power consumption.
“…8b). Although the theoretical model describing intersubband scattering is known (26), (29), phenomenological equations can be used to have a more analytical model (30). In this simplified approach, front and back channel mobility can be evaluated separately at each interface with:…”
Section: Effect Of Back Bias On the Electrostatics And Transport Prop...mentioning
We present an overview of the performances of FDSOI CMOS transistors down to deep cryogenic temperature, highlighting in particular the benefits brought by the back bias. FDSOI transistors are operational from room temperature down to temperature as low as 100mK. The main DC electrical characteristics, as well as variability properties and reliability are measured and analyzed. We also point out specific behaviors appearing at cryogenic temperature, and discuss their physical origin and modeling.
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