Abstract:We report, for the first time, the resistive switching properties of Si-doped Ta2O5 grown by atomic layer deposition (ALD). The reduced switching current, improved on/off current ratio, and excellent endurance property are demonstrated in the Si-doped Ta2O5 resistive random access memory (ReRAM) devices of 50 nm tech node. The switching mechanism for the Si-doped Ta2O5 resistor is discussed. Si dopants enable switching layer to have conformal distribution of oxygen vacancy and easily form conductive filament. … Show more
“…Thus, in current investigation, we demonstrated the direct current density dependence on stoichiometry of tantalum oxide. Oxygen vacancies acting as traps allow to explain the low values of resistances for LRS and HRS states for TaO x ReRAM. ,, However, in ReRAM the typical values of LRS resistance are 6–8 kOhm, while HRS values are of the 200–300 kOhm. For the discussed TaO x films with maximum nonstoichiometry (Figure a), for the readout field ∼1 MV/cm the current densities are of the order of 10 2 A/cm 2 and this corresponds to the resistance ∼1 MOhm, for a memory dot of ∼1 μm 2 area.…”
Section: Resultsmentioning
confidence: 99%
“…Stoichiometric tantalum oxide (Ta 2 O 5 ) dielectric films find wide applications in microelectronics due to their high dielectric constant (κ = 25–50), electrical strength, and good thermal and chemical stability. − In the last years, the interest to tantalum oxide strongly increased due to its successful use in nonvolatile resistive random access memories (ReRAM) or/and memristors, − especially after nonstoichiometric oxygen deficient tantalum oxide (TaO x ) based ReRAM was moved into production. , ReRAM is considered both for stand-alone data storage applications, as well as an embedded nonvolatile memory. Neuromorphic applications, in particular delegating a part of data processing to memories in computer architectures, are also considered. , Among various oxide-based resistive switching elements, devices based on TaO x exhibit excellent memory retention performance, switching speed, endurance (number of switching cycles), , and low power consumption. , The industrial tantalum oxide ReRAM is based on resistance changes in TaO x filaments formed in the stacked dielectric structures comprising TaO x and a stoichiometric Ta 2 O 5 .…”
Optical and transport properties of nonstoichiometric tantalum oxide thin films grown by ion beam deposition were investigated in order to understand the dominant charge transport mechanisms and reveal the nature of traps. The TaO films composition was analyzed by X-ray photoelectron spectroscopy and by quantum-chemistry simulation. From the optical absorption and photoluminescence measurements and density functional theory simulations, it was concluded that the 2.75 eV blue luminescence excited in a TaO by 4.45 eV photons, originates from oxygen vacancies. These vacancies are also responsible for TaO conductivity. The thermal trap energy of 0.85 eV determined from the transport experiments coincides with the half of the Stokes shift of the blue luminescence band. It is argued that the dominant charge transport mechanism in TaO films is phonon-assisted tunneling between the traps.
“…Thus, in current investigation, we demonstrated the direct current density dependence on stoichiometry of tantalum oxide. Oxygen vacancies acting as traps allow to explain the low values of resistances for LRS and HRS states for TaO x ReRAM. ,, However, in ReRAM the typical values of LRS resistance are 6–8 kOhm, while HRS values are of the 200–300 kOhm. For the discussed TaO x films with maximum nonstoichiometry (Figure a), for the readout field ∼1 MV/cm the current densities are of the order of 10 2 A/cm 2 and this corresponds to the resistance ∼1 MOhm, for a memory dot of ∼1 μm 2 area.…”
Section: Resultsmentioning
confidence: 99%
“…Stoichiometric tantalum oxide (Ta 2 O 5 ) dielectric films find wide applications in microelectronics due to their high dielectric constant (κ = 25–50), electrical strength, and good thermal and chemical stability. − In the last years, the interest to tantalum oxide strongly increased due to its successful use in nonvolatile resistive random access memories (ReRAM) or/and memristors, − especially after nonstoichiometric oxygen deficient tantalum oxide (TaO x ) based ReRAM was moved into production. , ReRAM is considered both for stand-alone data storage applications, as well as an embedded nonvolatile memory. Neuromorphic applications, in particular delegating a part of data processing to memories in computer architectures, are also considered. , Among various oxide-based resistive switching elements, devices based on TaO x exhibit excellent memory retention performance, switching speed, endurance (number of switching cycles), , and low power consumption. , The industrial tantalum oxide ReRAM is based on resistance changes in TaO x filaments formed in the stacked dielectric structures comprising TaO x and a stoichiometric Ta 2 O 5 .…”
Optical and transport properties of nonstoichiometric tantalum oxide thin films grown by ion beam deposition were investigated in order to understand the dominant charge transport mechanisms and reveal the nature of traps. The TaO films composition was analyzed by X-ray photoelectron spectroscopy and by quantum-chemistry simulation. From the optical absorption and photoluminescence measurements and density functional theory simulations, it was concluded that the 2.75 eV blue luminescence excited in a TaO by 4.45 eV photons, originates from oxygen vacancies. These vacancies are also responsible for TaO conductivity. The thermal trap energy of 0.85 eV determined from the transport experiments coincides with the half of the Stokes shift of the blue luminescence band. It is argued that the dominant charge transport mechanism in TaO films is phonon-assisted tunneling between the traps.
“…Yasuhara et al reported a TaOx based low operation current RRAM device by controlling the oxygen content of the resistance-switching material [12]. Kim et al systematically analyzed the influence of Si doping in Ta 2 O 5 -based RRAM device, and 10 µA operating current is achieved because of conformal distribution of oxygen vacancies (Vo) in resistive layer [13].…”
In this work, an ultra low power switching is achieved in Ta 2 O 5 -based resistive random access memory (RRAM) device through inserting AlOx film as tunneling layer. After optimizing the thickness of the AlO X layer, the operating current of the device with 15 nm AlO X is reduced to lower than 100 nA with a switching window about 151, and the ultra-low power consumptions of 586 pW and 40.2 nW are achieved for set and reset process, respectively. According to the local conductive filament formation characterization from high-resolution transmission electron microscope and the calculation from Schottky emission formula, a switching mechanism based on the formation of local oxygen vacancies conductive filament in AlO X layer is proposed to explain the ultralow power switching of the Ta 2 O 5 /AlO X bilayer synergistic RRAM device.
“…Both of these changes can potentially lead to promising doped oxides with low operating voltages, good retention, high endurance, as well as high ON/OFF ratio. Many studies have been conducted to explore the doping effect on resistive switching device performance. − For example, Zhao et al − from Stanford University and Zhao et al from Anhui University systematically studied the trend of V O formation energy in metal-doped TiO 2 and HfO 2 using first principle-calculations. The authors concluded that a larger difference in the number of valence electrons between the dopant and the host atom can cause more significant reduction in the V O formation energy near the dopants .…”
Section: Introductionmentioning
confidence: 99%
“…In addition, they also found that as the formation energy of V O decreases, the forming voltage and ON/OFF current ratio also decrease in metal-doped HfO 2 resistive switching devices. Besides metal dopants, the doping effect of nonmetal dopants such as H, N, C, and Si in memory switching oxides was also widely studied. ,− …”
Introducing dopants is an important way to tailor and improve electronic properties of transition metal oxides used as high-k dielectric thin films and resistance switching layers in leading memory technologies, such as dynamic and resistive random access memory (ReRAM). TaO has recently received increasing interest because TaO-based ReRAM demonstrates high switching speed, long endurance, and low operating voltage. However, advances in optimizing device characteristics with dopants have been hindered by limited and contradictory experiments in this field. We report on a systematic study on how various metal dopants affect oxygen vacancy formation in crystalline and amorphous TaO from first principles. We find that isoelectronic dopants and weak n-type dopants have little impact on neutral vacancy formation energy and that p-type dopants can lower the formation energy significantly by introducing holes into the system. In contrast, n-type dopants have a deleterious effect and actually increase the formation energy for charged oxygen vacancies. Given the similar doping trend reported for other binary transition metal oxides, this doping trend should be universally valid for typical binary transition metal oxides. Based on this guideline, we propose that p-type dopants (Al, Hf, Zr, and Ti) can lower the forming/set voltage and improve retention properties of TaO ReRAM.
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