Low-Power ASK Detector for Low Modulation Indexes and Rail-to-Rail Input Range

Fiore, Vincenzo; Ragonese, Egidio; Palmisano, G.

doi:10.1109/tcsii.2015.2503651

Cited by 17 publications

(6 citation statements)

References 8 publications

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“…7. It adopts a common-source (CS) topology as the rectifier stage, which inherently provides high input impedance along with good voltage gain, and low current consumption [40], [41]. The CS rectifier is ac coupled to the RX microantenna, L RX , to allow central tap grounding to be achieved, which is essential to provide a low-impedance path for the common-mode transient currents and thus improving CMTI [11], [12].…”

Section: B Rx Front End For Unidirectional Isolation Channelsmentioning

confidence: 99%

A Three-Channel Package-Scale Galvanic Isolation Interface for Wide Bandgap Gate Drivers

Spina,

Raimondi,

Castorina

et al. 2024

IEEE Trans. VLSI Syst.

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This article presents the design of a three-channel package-scale galvanic isolation interface for SiC and GaN power switching converters. The isolation interface consists of two side-by-side co-packaged chips fabricated in a low-cost 0.32-µm bipolar CMOS-DMOS (BCD) technology and includes three isolation data channels based on RF-coupled integrated microantennas. The isolation interface provides a channel for the gate driver control, a bidirectional channel for diagnostic, and a channel for the isolated power supply control. They use on-off keying (OOK)-modulated RF carriers of 1.5, 0.5, and 1.5 GHz, respectively. The galvanic isolation interface provides a maximum signal rate of 2 and 1.9 MHz for the driver and the power control channels, respectively, whereas the diagnostic channel guarantees half-duplex bidirectional communication up to 15 MHz. Thanks to the package-scale isolation approach, both reinforced galvanic isolation and first-rate common-mode transient immunity (CMTI) are achieved. High immunity to adjacent channel crosstalk is guaranteed by using channel frequency/physical separation. To best of the authors' knowledge, this is the first implementation of a package-scale galvanic isolation interface with three independent communication channels, including a bidirectional channel, in silicon technology.

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Section: B Rx Front End For Unidirectional Isolation Channelsmentioning

confidence: 99%

A Three-Channel Package-Scale Galvanic Isolation Interface for Wide Bandgap Gate Drivers

Spina,

Raimondi,

Castorina

et al. 2024

IEEE Trans. VLSI Syst.

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“…9. Specifically, it adopts a common-source configuration with resistive load, R L, which guarantees good voltage gain and low consumption [46]- [48]. A common-gate transistor, Q E11 , is also included to reduce the capacitive effect on the rectifier input due to the gate-drain capacitances of the input pair, Q E8,9 .…”

Section: Rx Front-end Designmentioning

confidence: 99%

A GaN-Integrated Galvanically Isolated Data Link Based on RF Planar Coupling With Voltage Combining for Gate-Driver Applications

Spataro,

Ragonese,

Spina

et al. 2024

IEEE Access

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In this paper the design of a galvanically isolated data link for gate-driver applications in GaN technology is presented. The isolation channel exploits the near-field RF planar coupling between micro-antennas placed on two side-by-side co-packaged chips. Adopted package-scale isolation has several benefits i.e., the applicability to any integration technology and the capability to achieve both very high isolation rating and common-mode transient immunity by means of a proper distance between chips. The isolation channel adopts an RF carrier of 2 GHz that is modulated by a PWM signal. For the first time, a voltage-combining approach based on multiple antennas has been explored in a galvanically isolated data link. Specifically, the TX front-end consists of two capacitively coupled RF oscillators connected to two differential antennas designed for voltage combining. The RX front-end combines the transmitted RF signals by means of one differential antenna and extracts the PWM signal by means of a rectifier and an amplifier with a dynamic offset compensation. Emphasis is given to the design of micro-antennas, which is essential to minimize channel loss. The data link was tested by using a chip-on-board assembly to validate the proposed approach. The overall current consumption was lower than 4 mA for a PWM signal of 500 kHz and a duty cycle of 50%.INDEX TERMS Class D oscillator, current-reuse, dynamic offset compensation, galvanic isolation, GaN technology, gate driver, on-chip antennas, voltage-combining.

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“…ASK modulation is a widely used method due to its simplicity and the demodulation circuit usually consists of an envelope detector (ED) and a comparator. However, implementing an envelope detector demodulation circuit with a high DR, low MD, high conversion gain, and low power consumption can be challenging [3], [21], [33], [34].…”

Section: Ask Demodulator With Low Power Consumption and High Drmentioning

confidence: 99%

Simultaneous High-Efficiency Power Delivery and Energy-Efficient Forward Data Transmission Over Single Inductive Link

et al. 2023

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This paper presents a system for simultaneous wireless power and data transfer (SWPDT) over a single inductive link. We design the frequency-splitting inductive link to address the trade-off between high power transfer efficiency (PTE) and high data rate (DR). An active rectifier is designed for high power conversion efficiency. Forward data communication is based on frequency-shift keying (FSK) modulation to support high DR transmission while delivering uninterrupted power. Moreover, we proposed low-power FSK demodulation circuits to further improve the energy efficiency of the data demodulation. The system is implemented with 180nm CMOS process and occupies an area of 0.836mm 2 . The post-layout simulation results show that the overall PTE (including the resonant tanks and the active rectifier) of the SWPDT system can be up to 76.5% while delivering 40mW power to the load. Meanwhile, a data rate of 1.11Mbps can be achieved. The power consumption for data demodulation is 69.1µW, showing an energy efficiency of 62.2pJ/bit. The proposed SWPDT system based on a single inductive link shows potential for implantable biomedical applications.INDEX TERMS Simultaneous wireless power and data transfer (SWPDT), frequency splitting, energy efficient, active rectifier, injection lock, shifted limiter.

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Low-Power ASK Detector for Low Modulation Indexes and Rail-to-Rail Input Range

Cited by 17 publications

References 8 publications

A Three-Channel Package-Scale Galvanic Isolation Interface for Wide Bandgap Gate Drivers

A Three-Channel Package-Scale Galvanic Isolation Interface for Wide Bandgap Gate Drivers

A GaN-Integrated Galvanically Isolated Data Link Based on RF Planar Coupling With Voltage Combining for Gate-Driver Applications

Simultaneous High-Efficiency Power Delivery and Energy-Efficient Forward Data Transmission Over Single Inductive Link

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