Low-frequency ‘delay time’ ultrasound and its effect on electroless Cu metallisation of a Pd activated dielectric material

Cobley, Andrew; Tudela, Ignacio; Abbas, Bahaa; Mkhlef, B

doi:10.1016/j.tsf.2015.11.068

Cited by 5 publications

(3 citation statements)

References 18 publications

(1 reference statement)

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“…Based on the above analyses, it was inferred that the substitution of Sn 4þ by Sb 5þ would increase the conductivities of the anodes due to excess electrons. Besides, permeating in Sn vacancies of SnO 2 , Sb as cationic doping could accelerate the charge transfer of the electronic conductor (Cobley et al 2015).…”

Section: Physicochemical Characterizationmentioning

confidence: 99%

Facile synthesis of highly active Ti/Sb-SnO2 electrode by sol-gel spinning technique for landfill leachate treatment

Zhang

et al. 2021

Water Science and Technology

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Highly active Ti/Sb–SnO2 electrodes were fabricated using sol-gel spin coating procedure, which exhibited a rough, uniform and multilayer coating structure. The effects of different Sb-SnO2 film layers on the physiochemical, electrochemical properties and pollutant degradability of electrodes and the mechanism were evaluated on a systematic basis. The electrodes with more active layers exhibited higher electro-catalytic performance. Upon exceeding 8 layers, the promotion effect of the coating was reduced. Considering various factors, this paper recommends preparing Ti/Sb–SnO2 electrodes coated with 8 layers to obtain higher electro-catalytic ability in landfill leachate treatment. The specific number of coating layers should be determined according to the electrode requirements. This work provided a theoretical basis and technical support for the preparation of Ti-SnO2 electrodes with high electro-catalytic activity and stability, while it still remains a great challenge to achieve an excellent balance between performance and stability before Ti/Sb-SnO2 electrodes can be implemented on a large scale in wastewater treatment.

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Section: Physicochemical Characterizationmentioning

confidence: 99%

Facile synthesis of highly active Ti/Sb-SnO2 electrode by sol-gel spinning technique for landfill leachate treatment

Zhang

et al. 2021

Water Science and Technology

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“…[19,20] The CuNPs were employed as catalysts to replace traditional Sn/Pd catalysts for catalyzing electroless (ELS) copper deposition on the hole wall. [21][22][23][24][25] The ELS copper deposition was performed in a commercialized plating solution (JCU Corporation, Japan) at 40℃ 5/31 for 30 min. The final ELS copper thickness deposited onto the hole wall was about 1~2 m.…”

Section: Plating Through Holementioning

confidence: 99%

Effects of Brighteners in a Copper Plating Bath on Throwing Power and Thermal Reliability of Plated Through Holes

Chen

Tsai

Hsu

et al. 2016

Electrochimica Acta

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“…However, they eventually reach an unstable size and produce smaller microbubbles that then collapse violently during the subsequent compression wave. Collapsing bubbles next to the substrate surface are subjected to micro jetting, which can remove any impurities on the surface [108].…”

Section: Khz Sonication Bath Utilized In Substrate Cleaningmentioning

confidence: 99%

Processing of nano-micro copper materials for the production of conductive circuits

Abbas¹

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Copper inks potentially provide a cost-effective alternative to silver for printed electronic circuits. In glass-based applications such as PV or smart glass, they can provide a means of conductivity enhancement or additional functionality. Three inks consisting of a mixture of nano and micro copper particles were systematically studied to examine the relationship between sintering temperature, sintering time and gaseous environment on the electrical qualities of the sintered printed films deposited on FTO coated glass. There is a definite interaction between the particulate nature of the ink, the sintering conditions, and the conductive properties of the film. Films containing only nano-particles provide the most conductive films with optimum sintering conditions of temperature of 225 °C for 60 minutes. The inclusion of micro particles increased the ideal sintering temperature but lowered the sintering time. An ink containing an equal mixture of nano and micro particles exhibited the lowest performance. This could be attributed to partial oxidation of the nano-particles along the conductive path, which occurs as a result of the presence of the micro particles. Other samples were photonically sintered using a PulseForge 1200 laboratory photonic sintering unit where the number of pulses, pulse power, pulse frequency and the intra pulse gap could be varied. An initial optimization study identified an operational range of photonic energy profile. The best possible line conductivity obtained using these optimum conditions was around a 1/3 of that obtained by conventional thermal sintering. This relative conductivity of photonically sintered features further deviated from conventionally sintered features as the film thickness increased and as the line width reduced. Laser / NIR techniques were found ineffective to sinter the copper ink used in this study. The possibility to manually blend copper and silver paste ink was investigated and an optimum blend of 25% silver and 75% copper could be used which had maintained conductivity, cost, and adhesion benefits.

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Low-frequency ‘delay time’ ultrasound and its effect on electroless Cu metallisation of a Pd activated dielectric material

Cited by 5 publications

References 18 publications

Facile synthesis of highly active Ti/Sb-SnO2 electrode by sol-gel spinning technique for landfill leachate treatment

Facile synthesis of highly active Ti/Sb-SnO2 electrode by sol-gel spinning technique for landfill leachate treatment

Effects of Brighteners in a Copper Plating Bath on Throwing Power and Thermal Reliability of Plated Through Holes

Processing of nano-micro copper materials for the production of conductive circuits

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