A flexible and totally wearable textile antenna is proposed by embroidering the conductive threads into garments. A purely polyester substrate has been utilized, which provides a tag that can be easily integrated with the clothes. The proposed tag antenna is small with dimensions of 72 × 20 × 2.75 mm3 and offers an enhanced performance in terms of gain and stability when worn on different body locations. Experimental results demonstrate an improved impedance matching owing to the elasticity of the E-shaped inductive feeder. Close agreement has been achieved between the simulated and measured results.
Copper inks potentially provide a cost effective replacement to silver for printed electronic circuits. In glass based applications such as PV or smart glass, it can provide a means of conductivity enhancement or additional functionality. Three inks consisting of a mixture of nano and micro copper particles were systematically studied to examine the relationship between sintering temperature, sintering time and gaseous environment on the electrical qualities of the sintered printed films deposited on FTO coated glass. There is a definite interaction between the particulate nature of the ink, the sintering conditions and the conductive properties of the film. Films containing only nano-particles provide the most conductive films with optimum sintering conditions of temperatures of 225 °C for 60 minutes. The inclusion of micro particles increased the ideal sintering temperature but lowered the sintering time. An ink containing an equal mixture of nano and micro particles exhibited the lowest performance and this could be attributed to partial oxidation of the nano-particles along the conductive path, which occurs as a result of the presence of the micro particles.
A widely deployed cellular network, supported by direct connections, can offer a promising solution that supports new services with strict requirements on access availability, reliability, and end-to-end (E2E) latency. The communications between vehicles can be made using different radio interfaces: One for cellular communication (i.e., cellular communication over the cellular network based on uplink (UL)/downlink (DL) connections) and the other for direct communication (i.e., D2D-based direct communications between vehicles which allows vehicular users (V-UEs) to communicate directly with others). Common cellular systems with licensed spectrum backed by direct communication using unlicensed spectrum can ensure high quality of service requirements for new intelligent transportation systems (ITS) services, increase network capacity and reduce overall delays. However, selecting a convenient radio interface and allocating radio resources to users according to the quality of service (QoS) requirements becomes a challenge. In this regard, let’s introduce a new radio resource allocation strategy to determine when it’s appropriate to establish the communication between the vehicles over a cellular network using licensed spectrum resources or D2D-based direct connections over unlicensed spectrum sharing with Wi-Fi. The proposed strategy aims at meeting the quality of service requirements of users, including reducing the possibility of exceeding the maximum delay restrictions and enhancing network capacity utilization in order to avoid service interruption. The proposed solution is evaluated by highlighting different conditions for the considered scenario, and it is demonstrated that the proposed strategy improves network performance in terms of transmitted data rate, packet success rate, latency, and resource usage
Electroless plating is an important process for the metallization of non-conductive substrates and is therefore widely utilized throughout the electronics and packaging industry. Electronic manufacture now requires processes and materials that can meet the demands for miniaturization and reliability since holes and via diameters in both printed circuit boards (PCBs) and microelectronics are being reduced whilst aspect ratios are getting higher. It is critical for the future development of electronics that manufacturing processes become adapted to meet these requirements. In terms of electroless plating, miniaturization means that ensuring full coverage in vias and holes is extremely challenging whilst the electroless deposit structure is important to ensure high reliability, high conductivity etc. In addition the plating process must be able to meet the need for high production volumes (i.e. high deposition rates) whilst enabling more sustainable, low energy manufacturing. Performing electroless plating in an ultrasonic field has great potential to enhance the deposit properties and meet these advanced manufacturing requirements. This paper will discuss the results from the IeMRC funded ULTIEMet (Ultrasonically enabled Low Temperature Immersion and Electroless Metallization) research project which has utilized a methodology incorporating a mixture of electrochemical and laboratory plating tests. It has been found that by optimizing how ultrasound is introduced to the electroless process benefits such as reduced temperature plating, enhanced coverage and a finer grain structure deposit can be realized.
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