several issues such as reliability and device performance. [ 4 ] To solve these problems, research has focused on material engineering, [ 5 ] post treatment engineering, [ 6,7 ] and structural engineering [ 8,9 ] approaches. However, the optimal structure for AOS TFTs has not been established, whereas amorphous and polycrystalline Si TFTs are generally manufactured with bottom-and top-gate structures, respectively.In AOS TFTs with a top-gate structure, the back-channel is not exposed to the environment because the gate dielectric acts as a passivation layer that prevents interaction with ambient gases. [ 10 ] Furthermore, the top-gate structure effectively reduces resistance-capacitance (RC) delay by decreasing overlap of the source/drain and gate electrodes via a self-alignment process. [ 11 ] Hence, the top-gate structure has also been suggested for the AOS TFT back-plane technology for high resolution and large displays. However, the top-gate structure is relatively diffi cult to manufacture using current production lines that use conventional fabrication processes designed for amorphous Si TFTs; many process steps are required. Although AOS TFTs with a bottom-gate structure could be manufactured more easily with existing processes, an additional etch stopper layer must be deposited to prevent chemical damage from occurring during the metal etching process, when the back-channel etch structure is employed. [ 12 ] Furthermore, a true passivation layer is needed because of the exposure of the back-channel to the external environment, [ 12,13 ] and the overlap between the source/ drain and gate electrodes causes poor device performance. [ 14 ] For these reasons, a hetero multi-stacked structure has recently been suggested. [ 8,9 ] This structure could improve the electrical characteristics and enable self passivation, without an additional passivation layer, by depositing channel material repeatedly during channel layer fabrication. In a hetero multi-stack structure, the front-channel has high conductivity and the backchannel has low conductivity because each layer leads to a moderate current fl ow and self passivation, respectively. However, a hetero multi-stack structure has several issues: the presence of interfaces in the middle of the channel layer, complicated diffusion effects among the channel layers, and high fabrication cost because of the need to use several depositions of rare materialsThe present study suggests a way to improve electrical characteristics and stabilities by forming a different stoichiometry in a homogeneous system without using a multiple deposition process. Post treatment by sequential pressure annealing (SPA) of a homogeneous indium-zinc oxide system is carried out to fabricate vertically graded oxygen defi ciencies via redox reactions. The SPA treatment consists of several steps. First, hydrogen pressure annealing is performed to chemically expedite the reduction reaction of weak chemical bonds in the overall channel region and thereby make the material highly conducting. Second, o...