Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature

Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

“…The current acceptable technological solutions for the realization of SiC/metal joints face difficulties mainly due to different coefficients of thermal expansivity, which are often the reason for the failure of such joints [ 2 ]. Chen et al [ 3 ] proposed the use of an interlayer with the desire to minimize the yield stress, and thereby maximize the potential for the relaxation of thermal expansion mismatch stresses by plastic flow. The SiC ceramic is a covalent material and almost non-wettable by pure metals [ 4 ].…”

Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores

“…Nano-silver paste is an emerging lead-free bonding material used as a substitute for Sn/Pb solders in SiC or GaN power electronics, owing to its high melting temperature (961.8 °C), good thermal conductivity (200-300 W/m•K) and excellent long-term reliability [1][2][3][4][5]. Due to its high-energy free surface, nano-silver paste can be sintered at a temperature as low as 0.38 Tm (~200°C) which is well below the melting point [6][7][8].…”

“…Low temperature sintering process reduces the damage to dies in the power devices or modules, but it also induces inevitable pores in the bonding structures. Despite the improvement of sintering pressure and time, the porous microstructure in the nano-silver paste could not be eliminated and often exhibit stochastic uncertainties, which significantly affect the mechanical strength, thermal conductivity, and fatigue properties of the nano-silver joints [4,[9][10][11][12].…”