Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses

Kim, Dong-Jin; Lee, Sang‐Min; Chen, Chuantong; Lee, Seung-Joon; Nagao, Shijo; Suganuma, Katsuaki

doi:10.1007/s10853-021-05924-z

Cited by 25 publications

(2 citation statements)

References 41 publications

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“…This includes the calculation of stress, strain, displacement, damage, and fatigue life, and the visualization of these quantities using contour plots, vector plots, and path plots [18].The FEA results are validated against experimental data to ensure the accuracy and reliability of the proposed material model and fracture criteria. The validation involves the comparison of the FEA results with the experimental data in terms of stress-strain curves, load-displacement curves, and fracture patterns [19]. The proposed FEA methodology provides a powerful tool for predicting and analyzing the fracture behavior and failure mechanisms of various engineering materials under different loading conditions.…”

Section: Post-processingmentioning

confidence: 99%

Modelling and Simulation of Fracture Mechanics and Failure Analysis of Materials using FEA

Singhal,

Srividhya,

Kumar

et al. 2023

E3S Web Conf.

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This paper presents a comprehensive study on the modelling and simulation of fracture mechanics and failure analysis of materials using Finite Element Analysis (FEA). The research introduces a novel approach to predict and analyze the fracture behavior and failure mechanisms of various engineering materials under different loading conditions. The developed model incorporates advanced material constitutive relations and fracture criteria, providing a more accurate representation of the complex physical phenomena involved in material failure. The simulation results are validated against experimental data, demonstrating high accuracy and reliability of the proposed model. The study also explores the influence of microstructural characteristics on the fracture behavior, thereby bridging the gap between microscale and macroscale fracture mechanics. The findings of this research not only enhance our understanding of fracture mechanics but also provide a powerful tool for engineers to design more durable and reliable materials and structures. This work has significant implications for industries where material failure can lead to catastrophic consequences, such as aerospace, automotive, and civil engineering.

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Section: Post-processingmentioning

confidence: 99%

Modelling and Simulation of Fracture Mechanics and Failure Analysis of Materials using FEA

Singhal,

Srividhya,

Kumar

et al. 2023

E3S Web Conf.

View full text Add to dashboard Cite

show abstract

“…To date, various types of future devices, such as wearable devices, have been developed and demonstrated based on market needs. Silver particle-based pastes have also recently received considerable attention as die-attach materials for the fabrication of next-generation SiC- and GaN-based power devices 13 , 14 . The larger bandgaps of SiC- and GaN-based power semiconductor materials than the corresponding Si-based materials enable device operation above 200 °C, which could permit miniaturization of the power modules.…”

Section: Introductionmentioning

confidence: 99%

A mild aqueous synthesis of ligand-free copper nanoparticles for low temperature sintering nanopastes with nickel salt assistance

Imamura

Kamikoriyama

Muramatsu

et al. 2021

Sci Rep

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An organic ligand-free aqueous-phase synthesis of copper (Cu) nanoparticles (NPs) under an air atmosphere was successfully achieved by reducing copper(II) oxide particles with a leaf-like shape in the presence of Ni salts at room temperature. The resulting Cu NPs with a mean particle diameter of ca. 150 nm exhibited low-temperature sintering properties due to their polycrystalline internal structure and ligand-free surface. These Cu NPs were applied to obtain Cu NP-based nanopastes with low-temperature sintering properties, and the resistivities of the obtained Cu electrodes after annealing at 150 °C and 200 °C for 30 min were 64 μΩ∙cm and 27 μΩ∙cm, respectively. The bonding strength between oxygen-free Cu plates prepared using the Cu NP-based nanopastes reached 32 MPa after pressure-less sintering at 260 °C for 30 min under a nitrogen atmosphere. The developed manufacturing processes using the developed Cu nanopastes could provide sustainable and low-CO2-emission approaches to obtain Cu electrodes on flexible films and high-strength bonding between metal plates as die-attach materials for power devices under energy- and resource-saving conditions.

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Antioxidative copper sinter bonding under thermal aging utilizing reduction of cuprous oxide nanoparticles by polyethylene glycol

Matsuda,

Yamada,

Okubo

et al. 2023

J Mater Sci

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Durability of sintered Cu joints under thermal aging in the air was investigated for the reduction of Cu2O using Cu2O/polyethylene glycol (PEG) mixture. Thermal analysis of the Cu2O/PEG paste showed that the molecular weight of PEG influences the redox reaction and the subsequent bonding related to the combustion of the reducing organic solvent. Sintered Cu joints using PEG 400 exhibited high joint strength (above 30 MPa) in shear tests, even for the bonding temperature of 280 °C. The sintered Cu joints exhibited slightly increased strength during thermal aging at 250 °C in air, which was also confirmed by the microscale tensile test used for evaluating the fracture behavior of the sintered Cu structure. Microstructural analysis, including the evaluation of the crystal orientation, revealed a small change in the microstructure of sintered joints during aging. Transmission electron microscopy revealed the presence of organic membranes on slightly oxidized sintered Cu grains before thermal aging, and additional oxidation was observed after thermal aging. The progress of sintering during thermal aging in vacuum was different than that in air. It was considered that the formation of a thin Cu2O layer, controlled by the presence of organic membranes, contributed to the suppression of Cu sintering. Graphical abstract

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Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses

Cited by 25 publications

References 41 publications

Modelling and Simulation of Fracture Mechanics and Failure Analysis of Materials using FEA

Modelling and Simulation of Fracture Mechanics and Failure Analysis of Materials using FEA

A mild aqueous synthesis of ligand-free copper nanoparticles for low temperature sintering nanopastes with nickel salt assistance

Antioxidative copper sinter bonding under thermal aging utilizing reduction of cuprous oxide nanoparticles by polyethylene glycol

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