Abstract:The aim of this research was to study the wettability and solderability of SiC ceramics by the use of an active solder of the type Sn5Sb3Ti in a vacuum by electron beam heating. This solder exerts a narrow melting interval, and only one thermal effect, a peritectic reaction, was observed. The liquidus temperature of the solder is approximately 243 °C. The solder consists of a tin matrix where the Ti6(Sb,Sn)5 and TiSbSn phases are precipitated. The solder wettability on a SiC substrate decreases with decreasing… Show more
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