2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) 2018
DOI: 10.1109/wipdaasia.2018.8734562
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Layout of Series-connected SiC MOSFET Devices for Medium Voltage Applications

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Cited by 4 publications
(2 citation statements)
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“…The stray inductance of the power block is the result of the stray inductance of the laminated busbar and the device's internal stray inductance. The laminated bus bar design has been discussed in [31] and the total inductance is 115 nH. The internal inductance of the power module is 13 nH, which is obtained from the datasheet.…”
Section: Prototyping Of 96 Kv/200 a Power Blockmentioning
confidence: 99%
See 1 more Smart Citation
“…The stray inductance of the power block is the result of the stray inductance of the laminated busbar and the device's internal stray inductance. The laminated bus bar design has been discussed in [31] and the total inductance is 115 nH. The internal inductance of the power module is 13 nH, which is obtained from the datasheet.…”
Section: Prototyping Of 96 Kv/200 a Power Blockmentioning
confidence: 99%
“…The current source gate driver for the series connection of SiC MOSFETs is reported in [29]. The series connection of the SiC MOSFETs with capacitor snubber under soft-switching conditions has been reported in [30,31], where the device turns off at a relatively low current at 5 kV/400 V DC LLC converter. However, for a general case, previous work lacks a thorough analysis on the dynamic performance of the series connection of power devices (both active devices and the freewheel diodes), including the switching loss/speed under various operation conditions, continuous running under variable load currents and integration into the medium voltage high power converters.…”
Section: Introductionmentioning
confidence: 99%