2020
DOI: 10.1016/j.carbon.2020.06.038
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Layered structure of alumina/graphene-augmented-inorganic-nanofibers with directional electrical conductivity

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Cited by 14 publications
(21 citation statements)
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“…However, under the employed sintering parameters, none of the samples demonstrate features of a vermicular structure. A discussion on the sintering temperature and its effect on the microstructure of GAIN/Al 2 O 3 is detailed in [ 40 ]. The GAIN fillers are visibly located at the grain boundaries with a slight preferential orientation which is more pronounced for the composites of the high filler contents.…”
Section: Resultsmentioning
confidence: 99%
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“…However, under the employed sintering parameters, none of the samples demonstrate features of a vermicular structure. A discussion on the sintering temperature and its effect on the microstructure of GAIN/Al 2 O 3 is detailed in [ 40 ]. The GAIN fillers are visibly located at the grain boundaries with a slight preferential orientation which is more pronounced for the composites of the high filler contents.…”
Section: Resultsmentioning
confidence: 99%
“…The K L can be correlated to phonon mean free path ( λ ) using Equation (2), in which C p is the specific heat capacity, and V is the phonon group velocity of the bulk material [ 45 ]. The phonon group velocity of the bulk can be determined using Equation (3), where ρ is the bulk density, and E is the elastic modulus, attained from the previous paper of the authors [ 40 ]. The values of λ are presented in Figure 4 c for both in-plane and through-plane directions.…”
Section: Resultsmentioning
confidence: 99%
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“…Third, the architecture design of nanofillers should be considered. The designed shape and structure are most important aspects to realize the unique mechanical behaviors. Specially, the interlocking architecture can give full opportunity to enhance of nanofiller and greatly improve the mechanical properties of composite materials. Taking into account the above-mentioned issues, the introduction of a two-component silicon-based interlocking enhancement (SiCnws and Si 3 N 4 nbs) into CC should be a promising strategy to achieve simultaneous reinforcement for fiber/matrix interface and PyC matrix.…”
Section: Introductionmentioning
confidence: 99%