2017
DOI: 10.1007/s13233-017-5093-x
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Layer-by-layer assembly of graphene on polyimide films via thermal imidization and synchronous reduction of graphene oxide

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Cited by 8 publications
(7 citation statements)
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“…Among reinforcement fillers, hexagonal boron nitride (hBN) acts as a kind of promising fillers in the domain of thermal conductive composites owning to its excellent TC value (300 Wm −1 K −1 ), highly thermal stability and superb chemical stability 23 . Graphene perform well in enhancing the TC values of composites synergistically because graphene presents an ultrahigh TC value (~5000 Wm −1 K −1 ) 24,25 . Large amount of research have been done on preparing GO/PI films with high performance properties 25–28 .…”
Section: Introductionmentioning
confidence: 99%
“…Among reinforcement fillers, hexagonal boron nitride (hBN) acts as a kind of promising fillers in the domain of thermal conductive composites owning to its excellent TC value (300 Wm −1 K −1 ), highly thermal stability and superb chemical stability 23 . Graphene perform well in enhancing the TC values of composites synergistically because graphene presents an ultrahigh TC value (~5000 Wm −1 K −1 ) 24,25 . Large amount of research have been done on preparing GO/PI films with high performance properties 25–28 .…”
Section: Introductionmentioning
confidence: 99%
“…Inspired by the “polymer carpet”, Amin et al , grafted a solid-supported polymer monolayer on one side of a thin carbon film by surface-initiated polymerization, which resulted in the formation of composite films, which could be transferred from one environment to another one without losing their structural integrity. Polyimide (PI), as one of the high-performance engineering polymers, has attracted widespread attention in electronic industries as a promising polymer matrix or substrate due to its superior flexibility, excellent thermal stability, and high wear resistance. , Moreover, there are several current efforts for fabricating graphene/PI composite films via “molecular welding”. Li et al reported a subtle “molecular welding” strategy, which achieved the fabrication of flexible, ultrathin, highly conductive graphitized-graphene/PI hybrid films.…”
Section: Introductionmentioning
confidence: 99%
“…Polyimide (PI), as one of the high-performance engineering polymers, has attracted widespread attention in electronic industries as a promising polymer matrix or substrate due to its superior flexibility, excellent thermal stability, and high wear resistance. 35,36 Moreover, there are several current efforts for fabricating graphene/PI composite films via "molecular welding". Li et al 37 reported a subtle "molecular welding" strategy, which achieved the fabrication of flexible, ultrathin, highly conductive graphitized-graphene/PI hybrid films.…”
Section: Introductionmentioning
confidence: 99%
“…The deposition is fast and irreversible, with controllable deposit thickness and uniform surface coverage. 16 Layer-by-layer deposition significantly improves wettability and mechanical strength of scaffold. 15 The transformation of hydrophobic electrospun block copolymer to hydrophilic mesh using layer-by-layer method has shown significant improvement in cell viability and cell attachment of epidermal cells.…”
Section: Introductionmentioning
confidence: 99%
“…15 The transformation of hydrophobic electrospun block copolymer to hydrophilic mesh using layer-by-layer method has shown significant improvement in cell viability and cell attachment of epidermal cells. 12,17,16 In this study, electrospun PCL scaffolds were modified using graphene oxide (GO) and Cissus quadrangularis (CQ) plant callus extract.…”
Section: Introductionmentioning
confidence: 99%