“…Typically, p-n junctions are formed either by direct growth sequentially via thin film epitaxy from the substrate up or thermal diffusion using a solid or gaseous source, or ion implantation, into the substrate surface. Lateral p-n junctions along the substrate plane have long been desired for their geometric related properties: reduced junction capacitance, improved junction isolation by using semi-insulating substrates, coplanar contacts for ease of fabrication and increased ingretability [1], and the absence of high band-gap cladding for optoelectronic devices [2,3]. In addition, specific devices could directly benefit from lateral p-n junctions such as surface acoustic wave single photon emitters [4,5], laterally defined optoelectronic elements for photonic integrated circuits [6][7][8], high frequency optoelectronics [9], potential reduction in cost and increased freedom in circuit design for combined field effect and bipolar junction transistors (BiC-MOS) [10].…”