2010
DOI: 10.1116/1.3360891
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Lateral current injection photonic crystal membrane light emitting diodes

Abstract: Articles you may be interested inInGaN light-emitting diodes with indium-tin-oxide photonic crystal current-spreading layer

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Cited by 12 publications
(4 citation statements)
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“…17) Recently, lateral p-n junction approaches have been explored in an attempt to realize electrically pumped PC light sources. 18,19) This letter reports, to the best of our knowledge, the first successful lasing operation of an injectiontype membrane DFB laser with an LCI structure. cladding layers were composed of air (n ¼ 1) and SiO 2 (n ¼ 1:45), respectively.…”
mentioning
confidence: 92%
“…17) Recently, lateral p-n junction approaches have been explored in an attempt to realize electrically pumped PC light sources. 18,19) This letter reports, to the best of our knowledge, the first successful lasing operation of an injectiontype membrane DFB laser with an LCI structure. cladding layers were composed of air (n ¼ 1) and SiO 2 (n ¼ 1:45), respectively.…”
mentioning
confidence: 92%
“…To circumvent this issues, laterally-doped p-i-n structures were proposed recently. [22][23][24] CW lasing has been achieved by external cooling at an ambient temperature of ∼ 150 K. [23] Note that optically-pumped RT-CW lasing operation of a PhC nanolaser was already demonstrated by Nozaki, et al, [25] however, realization of its electrical counterpart has been a severe challenge. Therefore, we believe now is the time to reconsider the PhC slab design itself.…”
Section: Introductionmentioning
confidence: 99%
“…To circumvent this issues, laterally-doped p-i-n structures were proposed recently. [22][23][24] CW lasing has been achieved by external cooling at an ambient temperature of ∼ 150 K.…”
mentioning
confidence: 99%
“…Typically, p-n junctions are formed either by direct growth sequentially via thin film epitaxy from the substrate up or thermal diffusion using a solid or gaseous source, or ion implantation, into the substrate surface. Lateral p-n junctions along the substrate plane have long been desired for their geometric related properties: reduced junction capacitance, improved junction isolation by using semi-insulating substrates, coplanar contacts for ease of fabrication and increased ingretability [1], and the absence of high band-gap cladding for optoelectronic devices [2,3]. In addition, specific devices could directly benefit from lateral p-n junctions such as surface acoustic wave single photon emitters [4,5], laterally defined optoelectronic elements for photonic integrated circuits [6][7][8], high frequency optoelectronics [9], potential reduction in cost and increased freedom in circuit design for combined field effect and bipolar junction transistors (BiC-MOS) [10].…”
mentioning
confidence: 99%