Laser processing of ceramic and crystalline wafer substrates for microelectronic applications

Ashkenasi, David; Binder, Alexander; Jaber, Houssam; Kern, H.; Mueller, N.; Ziegert, Andreas

doi:10.1117/12.479234

Cited by 4 publications

(2 citation statements)

References 2 publications

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“…For AlN the acquired bore-hole is more constant in diameter, the maximum drilling depth reaches 15.8 mm at an aspect ratio of 1:175. Influence of beam quality To determine the influence of laser beam quality in high aspect laser micro drilling, comparative drilling studies into AlN and Al 2 O 3 using a non-commercial 100 W double-rod Nd:YAG laser system (LMTB) [6] and [7]in multimode configuration were conducted. The MOPA-system achieves significant deeper and leaner holes at identical laser parameters, except for the difference in beam quality, which lies one order of magnitude apart (MOPA: M² = 2.3; double-rod: M² = 20.5).…”

Section: Proc Of Spie Vol 4977 299mentioning

confidence: 99%

High-quality laser microdrilling of metals and ceramics with maximum aspect ratio

et al. 2003

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To meet the industry's demand for reducing machine cycle lengths concerning laser-drilling a Nd:YAG MasterOscillator Power-Amplifier (MOPA)-system was developed at the LMTB-laboratories that emits high-power peakpulses at excellent beam-quality. Presently, the output power of the oscillator (10W@1064nm) with a beam-quality of M²=1.3 is amplified to 95W@1064nm with M²=2.3 and a single pulse energy up to 500mJ. The pulse duration can be varied between 26 and 230ns. On account of the excellent beam quality, frequency conversion resulted in 49W@532nm and 4.8@266nm. The MOPA-System is used for laser micro drilling experiments into metals and ceramics where the influence of the beam quality on the geometrical shape of the hole is investigated and compared with applications conducted with similar laser systems. Additionally means in optimizing the drilling process such as burr-minimizing and melt-reduction were introduced. Furthermore, experiments using tapered drilling technique are undertaken. A maximum aspect ratio of 1:200 in stainless steel was obtained.

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Section: Proc Of Spie Vol 4977 299mentioning

confidence: 99%

High-quality laser microdrilling of metals and ceramics with maximum aspect ratio

et al. 2003

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“…Structuring of ITO films has a great impetus from industrial applications. Accordingly, laser patterning of ITO thin films on glass substrates has been extensively studied with various pulsed laser sources [22][23][24][25][26][27][28][29][30][31][32][33][34][35][36]. However, a detailed study of the incubation behavior of ITO films and its influence on laser patterning has not yet been reported.…”

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Incubation effect and its influence on laser patterning of ITO thin film

2012

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Micromachining of Metals, Alloys, and Ceramics by Picosecond Laser Ablation

Wei

Shin

King

2010

Journal of Manufacturing Science and Engineering

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Microhole drilling and microstructure machining with a picosecond (ps) Nd:YVO4 laser (pulse duration of 10 ps) in metals, alloys, and ceramics are reported. Blind and through microholes are drilled by percussion drilling as well as trepanning drilling, where the diameters of the holes are in the range of 20–1000 μm. Microfeatures are also machined and the flexibility of ps laser machining is demonstrated. The quality of drilled holes, e.g., recast layer, microcrack, and conicity, and that of the microstructures, are investigated by an optical microscope, a surface profilometer, or a scanning electron microscope. Ps laser ablation rate is studied by experiments and a simplified laser ablation model.

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Laser processing of ceramic and crystalline wafer substrates for microelectronic applications

Cited by 4 publications

References 2 publications

High-quality laser microdrilling of metals and ceramics with maximum aspect ratio

High-quality laser microdrilling of metals and ceramics with maximum aspect ratio

Incubation effect and its influence on laser patterning of ITO thin film

Micromachining of Metals, Alloys, and Ceramics by Picosecond Laser Ablation

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