Laser-induced chemical liquid phase deposition of metals: chemical reactions in solution and activation of dielectric surfaces

Laser-induced copper deposition with weak reducing agents

“…copper reduced in the bulk solution and deposited around the track in the form of separate crystals) [10]. Copper structures appearing with the use of formaldehyde, have the electrical resistivity 2-4 orders of magnitude higher than that of pure copper [8] or have no conductivity [11].…”

“…The dielectric was irradiated "from the side of the solution" for non-transparent substrates (glass-ceramics) and "from the side of the substrate" for transparent substrates. The dielectric and the electrolyte solution were placed on a motorised translation stage (7) driven by a controller (11). The operating commands from the computer (10) were generated using original software.…”

Laser-induced copper deposition from aqueous and aqueous–organic solutions: state of the art and prospects of research

“…52 Laser radiation is one of such actions. 1,10,11 This type of activation is arbitrarily referred to as physical.…”

“…Standard reduction potentials of reducing agents used for LCLD (E0) and the reduction potential difference between the Cu 2+ /Cu couple and the reducing agent in solution under standard conditions (DE0) and at 80 8C (DE), as well as at the metal/solution interface. 1,25 Reducing agent 7E…”

“…An analysis of the state of the art of investigations in the field of laser-induced deposition of metals shows that the following three groups of factors have an effect on the results of this process: 1 Ð physical factors (laser power and wavelength, scan rate, temperature of the environment and solution); Ð chemical factors (the composition of the solution, concentrations of the components, pH, chemical reactions in solution, photochemical processes in solution, the characteristic features of complexation in aqueous ± organic systems); Ð surface properties of the dielectric substrate (structure, the presence of activated and catalytic centres, defect structure, phase composition, chemical properties of the components of the dielectric material).…”