Kinetics of electroless Ni-Cu-P deposits on silicon in a basic hypophosphite-type bath

Liu, Weilong; Hsieh, Shu-Huei; Chen, W.J.

doi:10.1016/s1674-4799(09)60033-9

Cited by 7 publications

(3 citation statements)

References 19 publications

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“…However, it is still attractive in many research fields with the spreading of its application. Through developing novel surface pretreatment techniques [1] and solution additives [2][3][4][5], and optimizing control factors [6] etc., continuous and intensive studies are contributed to obtain satisfied deposits with desired composition, structures, patterns and properties on various substrates including active dissolving metals [7][8], nonmetallic materials [9][10][11], and semi-conductive materials [12][13].…”

Section: Introductionmentioning

confidence: 99%

Effects of complexing agents on acidic electroless nickel deposition

Jin

Yang

et al. 2010

Rare Metals

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Our previous study reported the influences of different complexing agents on electroless nickel (EN) by examining the properties of the deposits. In the present work, the effects of four common-used complexing agents on EN deposition rate and the stability of solution pH values were examined, either with an acetic pH buffer agent or absent of them. It is indicated that the pH buffering effect of them is dominative when the EN solution is lack of the pH buffer. Under this situation, the EN deposition rate increases with the concentration of complexing agents increasing. The EN deposition rate decreases with further adding the complexing agent when the solution already has enough pH buffer capability. Electrochemical impedance spectroscopy obtained during EN deposition illustrates that, in this case, the enhanced reaction resistance is the main reason for a lower deposition rate. However, the influence of polarization caused by mass transfer is not negligible at high complex ratio for sodium citrate and malic acid EN solutions.

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Section: Introductionmentioning

confidence: 99%

Effects of complexing agents on acidic electroless nickel deposition

Jin

Yang

et al. 2010

Rare Metals

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“…Electroless Ni-P coating is one of the most effective and economic hard coating for different industrial applications [2]. However, in some special fields, the properties of the Ni-P coatings are necessary to be improved.…”

Section: Introductionmentioning

confidence: 99%

Artificial neural networks implementation in Ni-Cu-P ternary coating: Investigation of the effects of bath stabilizers

Luan

Zou

2012

2012 8th International Conference on Natural Computation

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artificial neural networks (ANN) were implemented to model a complex chemical reaction system: process of electroless plating of Ni-Cu-P alloys. This model was developed to simulate and predict plating rate as a function of amount of stabilizers added in the bath. The neural network was established with three layers and trained by the back propagation learning algorithm. The training and testing data were obtained by experiments. The simulation results of the neural network coincided well with the experimental value. Hence artificial neural network is a reliable method to optimize the process parameters of Ni-Cu-P coating.

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“…For examples, the electroless deposited Ni-Fe-P and Ni-Co-P ternary alloy coatings are employed in computer industry, owing to their excellent magnetic properties [8][9]. The electroless deposited Ni-Cu-P ternary alloys have good corrosion resistance and conductivity [10][11]. The electroless deposited Ni-W-P ternary alloys have high melting point and hardness [12].…”

Section: Introductionmentioning

confidence: 99%

Preparation and Properties of Electroless Deposited Ni-Sn-P Ternary Alloy Coatings

Zhu

2011

AMR

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In this paper, Ni-Sn-P ternary alloy coating was prepared by the electroless depositing technique. Effects of tannic chloride, reductant and pH value of the bath on the coating were studied. And, erosion behavior of the coating in the 3.5g dm-1sodium chloride solution was also investigated. The results show that the electroless deposited Ni-Sn-P ternary alloy is amorphous. The deposition rate and the tin content in the coating increase, but the phosphorus content in the coating decreases with increasing the stannic chloride and sodium hypophosphite contents in the bath. The deposition rate increases with the pH value of the bath in the range of 3 to 6. Mass loss of the coating increases with increasing the erosion time and the flow velocity of erosion solution, which has its maximum value as the coating impacted at an angle of 60°.

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Kinetics of electroless Ni-Cu-P deposits on silicon in a basic hypophosphite-type bath

Cited by 7 publications

References 19 publications

Effects of complexing agents on acidic electroless nickel deposition

Effects of complexing agents on acidic electroless nickel deposition

Artificial neural networks implementation in Ni-Cu-P ternary coating: Investigation of the effects of bath stabilizers

Preparation and Properties of Electroless Deposited Ni-Sn-P Ternary Alloy Coatings

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