Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads

Li, Wangyun; Zhang, X.P.; Qin, Hongbo; Mai, Yiu‐Wing

doi:10.1016/j.microrel.2017.10.031

Cited by 19 publications

(6 citation statements)

References 6 publications

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“…6 The relationship between the thickness of IMC layer and the reflow soldering time shown in Fig. 8b 2 , a large amount of cleavage planes could be detected, suggesting that at Sn-58Bi/Cu-0.5Ni system, the fracture mechanism at the interface was brittle fracture mode after reflow soldering for 3 h. According to some literatures, cleavage planes always appeared on the IMC layer under the external force since the IMC grains were much brittle [44,45]. When the content of the Ni addition in the substrate reached to 5 wt%, the fracture behavior even propagated to the interface between the IMC layer and substrate, as the EDS result shown in Fig.…”

Section: Resultsmentioning

confidence: 86%

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Cheng

et al. 2020

Appl. Phys. A

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In the current investigation, various mass fractions (0, 0.5, 1.5, 5 and 10 wt%) of Ni were doped into Cu substrate, and influences of Ni addition on the microstructure evolution and mechanical property of the Sn-58Bi/Cu-xNi solder joint were investigated. Results showed that the growth rate of intermetallic compound (IMC) would increase with the Ni addition added from 0 to 5 wt% and remarkably decreased for Sn-58Bi/Cu-10Ni joint system. It indicated that the growth rate of IMC layer would decrease when 10 wt% Ni was added into the alloy. Besides, the tensile strength reduced with increase in the IMC thickness, which was under the synergistic effect of increasing liquid-state reaction time and the content of Ni addition (0-5 wt%). Moreover, the fracture mechanism gradually transformed from ductile fracture mode to brittle fracture mode with the decrease in joint strength.

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Section: Resultsmentioning

confidence: 86%

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Cheng

et al. 2020

Appl. Phys. A

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“…Figure 2a shows the shear stress in the Ni 3 Sn 4 solder joints; the results indicate the shear stress distribution in the three-dimensional 3D structure with different colors, and the maximum shear stress with red color was observed in the middle of Ni 3 Sn 4 IMC. In lead-free soldering, the Cu-Sn IMCs were the stress concentration locations (Ghosh et al, 2017;Li et al, 2018;Zhang et al, 2020a). Therefore, this area along the Ni 3 Sn 4 IMC layer was demonstrated to be the critical location, which may be the failure zone in service.…”

Section: Resultsmentioning

confidence: 99%

Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC

Zhang

Zhong

2021

Front. Mater.

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In this article, the 3D integration with Ni/Sn/Ni joints was conducted using transient liquid phase (TLP) bonding (250°C, 0.2 N) with different bonding time. After TLP bonding, plane-type Ni3Sn4 intermetallic compound (IMC) was observed, and when the bonding time is 180 min, complete Ni3Sn4 was found. The diffusion coefficient D was determined to be 32.4 μm2/min. Based on the finite element (FE) simulation, the results demonstrated that the shear stress and equivalent creep strain increased obviously with an increase in the IMC thickness; the results calculated show that the IMC thickness impacts the fatigue life of solder joints significantly, and the fatigue life decreases notably with an increase in the Ni3Sn4 thickness.

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“…Clearly, the most serious current crowding occurs at the groove of the Cu 6 Sn 5 grains closest to the electron flow entrance or exit, and the current density at the groove of the IMC grains decreases gradually when far away from the electron flow entrance or exit, as shown in Figure 17a. Moreover, the maximum current density (1.12 × 10 4 A/cm 2 ) at the groove of the Cu 6 Sn 5 grains is nearly twice the applied current density, as shown in Figure 17b, where a hot spot is likely to form due to the serious Joule heat [53]. When the temperature of the hot spot exceeds the melting point of the solder, a crack will be preferentially initiated at the melting site under shear stress.…”

Section: Fracture Behaviormentioning

confidence: 94%

Abnormal Shear Performance of Microscale Ball Grid Array Structure Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints with Increasing Current Density

Wang

Pan

2022

Crystals

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The shear performance and fracture behavior of microscale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints with increasing electric current density (from 1.0 × 103 to 6.0 × 103 A/cm2) at various test temperatures (25 °C, 55 °C, 85 °C, 115 °C, 145 °C, and 175 °C) were investigated systematically. Shear strength increases initially, then decreases with increasing current density at a test temperature of no more than 85 °C; the enhancement effect of current stressing on shear strength decreases and finally diminishes with increasing test temperatures. These changes are mainly due to the counteraction of the athermal effect of current stressing and Joule heating. After decoupling and quantifying the contribution of the athermal effect to the shear strength of solder joints, the results show that the influence of the athermal effect presents a transition from an enhancement state to a deterioration state with increasing current density, and the critical current density for the transition decreases with increasing test temperatures. Joule heating is always in a deterioration state on the shear strength of solder joints, which gradually becomes the dominant factor with increasing test temperatures and current density. In addition, the fracture location changes from the solder matrix to the interface between the solder matrix and the intermetallic compound (IMC) layer (the solder/IMC layer interface) with increasing current density, showing a ductile-to-brittle transition. The interfacial fracture is triggered by current crowding at the groove of the IMC layer and driven by mismatch strain at the solder/IMC layer interface, and the critical current density for the occurrence of interfacial fracture decreases with increasing test temperatures.

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Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads

Cited by 19 publications

References 6 publications

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint

Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC

Abnormal Shear Performance of Microscale Ball Grid Array Structure Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints with Increasing Current Density

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