Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC

Zhang, Liang; Zhong, Shengwen

doi:10.3389/fmats.2021.645782

Cited by 6 publications

(3 citation statements)

References 15 publications

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“…The essential intermetallic compounds (phase) of nickel tin (NiSn), iron tin (Fe 1.84 Sn), sulfur tin (SSn), chromium tin (Cr 2 Sn 3 ), chromium tin (CrSn 2 ), and tin phosphorus (SnP) were also present. Due to tin (Sn)-rich at the stainless steel (SS304) joint surface, the nickel-tin (NiÀ Sn) phase can be produced at the interface layer, especially in the boundary between the tin (Sn) and stainless steel SS304 during the bonding [42]. This is clearly indicated in the nickel-tin (NiÀ Sn) phase diagram.…”

Section: X-ray Diffraction (Xrd) Analysis At Intermetallic Layermentioning

confidence: 99%

Study on lap joining and characterization of tin (Sn) powder on stainless steel SS304 using microwave heating

Tayier,

Janasekaran,

Tai

2023

Materialwissenschaft Werkst

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Metal bonding via joints of low melting point materials such as zinc and tin has been technically challenging. This paper presents a unique technique for bonding small dimensions and the low melting point of materials through the microwave hybrid heating (MHH) process. Joint of stainless steel SS304 was applied to the joint with the tin (Sn) powder with the application of microwave radiation by using domestic microwave oven at 2.45 GHz of constant frequency, 200–360 W of microwave power, 120–180 s of exposure time, and 10–20 % of the epoxy rate. A developed heat chamber was used as a susceptor and insulator in the microwave hybrid heating (MHH) process. The tin powder and parent metals were strongly bonded as lap position by the microwave hybrid heating (MHH) process at 360 W of microwave power, 180 s of constant exposure time, and 20 % of the constant epoxy rate. Characterization of the joint was evaluated through microhardness and x‐ray diffraction (XRD) analysis techniques. It was found that the intermetallic compounds (phase) of nickel tin (NiSn), iron tin (Fe1.84Sn), sulfur tin (SSn), chromium tin (Cr2Sn3), chromium tin (CrSn2), and tin phosphorus (SnP) at the joint surface with highest microhardness obtained at 498.4 HV 0.05 at 360 W of microwave power.

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Section: X-ray Diffraction (Xrd) Analysis At Intermetallic Layermentioning

confidence: 99%

Study on lap joining and characterization of tin (Sn) powder on stainless steel SS304 using microwave heating

Tayier,

Janasekaran,

Tai

2023

Materialwissenschaft Werkst

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“…Solder joint is one of the major parts of electronic systems connecting various components to each other and delivering thermal, mechanical and electrical junctions [1][2][3]. However, the poor ductility and mechanical strength of solder joints sometimes put the reliability of electronic packages in harm's way, especially when they are exposed to the thermal cyclic loadings [4][5][6][7]. The main reason of failure in solder joints comes from the thermomechanical cyclic stresses caused by a variety of components with distinct coefficients of thermal expansion (CTE) [8,9].…”

Section: Introductionmentioning

confidence: 99%

Expectation–maximization machine learning model for micromechanical evaluation of thermally-cycled solder joints in a semiconductor

Chen

2023

J. Phys.: Condens. Matter

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This paper aims to study the microstructural and micromechanical variations of solder joints in a semiconductor under the evolution of thermal-cycling loading. For this purpose, a model was developed on the basis of expectation-maximization machine learning (ML) and nanoindentation mapping. Using this model, it is possible to predict and interpret the microstructural features of solder joints through the micromechanical variations (i.e. elastic modulus) of interconnection. According to the results, the classification of Sn-based matrix, intermetallic compounds and the grain boundaries with specified elastic-modulus ranges was successfully performed through the ML model. However, it was detected some overestimations in regression process when the interfacial regions got thickened in the microstructure. The ML outcomes also revealed that the thermal-cycling evolution was accompanied with stiffening and growth of intermetallic compounds; while the spatial portion of Sn-based matrix decreased in the microstructure. It was also figured out that the stiffness gradient becomes intensified in the treated samples, which is consistent with this fact that the thermal cycling increases the mechanical mismatch between the matrix and the intermetallic compounds.

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“…As Moore’s Law continues to advance, integrated circuit chips are becoming smaller and more densely packed (Li et al , 2019), which also puts forward higher requirements for electronic packaging technology. On one hand, electronic packages need to adopt smaller and tighter packages to accommodate the size and density of chips (Khan et al , 2018; Zhang and Zhong, 2021). On the other hand, electronic packaging must also possess characteristics such as higher signal transmission speeds and improved heat dissipation efficiency to meet the requirements of integrated circuits.…”

Section: Introductionmentioning

confidence: 99%

Effect of Si₃N₄ nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding

Chen,

Zhang,

Huang

et al. 2023

SSMT

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Purpose The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and practical implementation of innovative lead-free solder materials in the electronic packaging industry. Design/methodology/approach This study investigates the effect of adding Si3N4 NWs to Sn58Bi solder in various mass fractions (0, 0.1, 0.2, 0.4, 0.6 and 0.8 Wt.%) for modifying the solder and joining the Cu substrate. Meanwhile, the melting characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated. Findings The crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting point was caused, while it does not impact its functionality. An appropriate Si3N4 NWs content (0.2∼0.4 Wt.%) significantly improves its wettability, and modifies the microstructure and interfacial IMC layer. The shear strength increases by up to 10.74% when adding 0.4 Wt.% Si3N4 NWs, and the failure mode observed is brittle fracture mainly. However, excessive Si3N4 will cause aggregation at the junction between the solder matrix and IMC layer, this will be detrimental to the joint. Originality/value The Si3N4 NWs were first used for the modification of lead-free solder materials. The relative properties of composite solder and joints were evaluated from different aspects, and the optimal ratio was obtained.

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Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC

Cited by 6 publications

References 15 publications

Study on lap joining and characterization of tin (Sn) powder on stainless steel SS304 using microwave heating

Study on lap joining and characterization of tin (Sn) powder on stainless steel SS304 using microwave heating

Expectation–maximization machine learning model for micromechanical evaluation of thermally-cycled solder joints in a semiconductor

Effect of Si₃N₄ nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding

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Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC

Cited by 6 publications

References 15 publications

Study on lap joining and characterization of tin (Sn) powder on stainless steel SS304 using microwave heating

Study on lap joining and characterization of tin (Sn) powder on stainless steel SS304 using microwave heating

Expectation–maximization machine learning model for micromechanical evaluation of thermally-cycled solder joints in a semiconductor

Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding

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Effect of Si₃N₄ nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding