Investigations on Heat Extraction in Multilayer PCB Structures

Andreev, Svetozar; Spasova, Nina; Chikurtev, Denis

doi:10.1109/et.2018.8549638

Cited by 4 publications

(3 citation statements)

References 4 publications

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“…Therefore, the thermal conductivity is described as the gradient of the real part as a function of the logarithmic frequency, with (6) where U 3ω1 is the voltage at the third harmonic for a frequency f 1 and U 3ω2 the voltage at the third harmonic for frequency f 2 respectively.…”

Section: B Thermal Conductivitymentioning

confidence: 99%

“…By adding a heat sink on the back of the FR4 based PCBs, their thermal performance is improved. However, by implementing thermal vias, which are metal based throughholes, heat transfer is enhanced [6]. Furthermore, lower thermal resistance was accomplished by a reduction of pitch size, increasing the number of copper layers and the barrel thickness of the vias [7].…”

Section: Introductionmentioning

confidence: 99%

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Experimental Performance Analysis of Advanced Layers for Electronic Circuit Boards

Klarmann

Vagapov

Gotzig

2019

2019 54th International Universities Power Engineering Conference (UPEC)

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This paper provides an experimental performance analysis of advanced layers for electronic circuit boards. The base material of the advanced layers used in the experiments is Al-5052, with the dimensions of 100mm x 20mm x 1mm. As insulating material between the base and conductor, two aluminium coatings were investigated and the surface structure and thermal conductivity of the coatings were examined. Furthermore, three electroconductive adhesives were applied onto the coatings. Initially, electrical performance is investigated and electrical components were applied onto the new surface structure. Finally, the environmental tests were performed to determine the robustness of the evaluated system.

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Section: B Thermal Conductivitymentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Experimental Performance Analysis of Advanced Layers for Electronic Circuit Boards

Klarmann

Vagapov

Gotzig

2019

2019 54th International Universities Power Engineering Conference (UPEC)

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“…Several manufacturing technologies have been developed and proposed to improve the thermal capabilities of PCBs. FR-4 technology is most common in the electronic industry, where PCB based heat sinks and metal filled through-holes are widely implemented to improve thermal performance [7]. The reduction in thermal resistance of PCB structure was also achieved by optimising barrel thickness of through holes and amount of copper layers within the PCB structure itself [8], [9].…”

Section: Introductionmentioning

confidence: 99%

Thermal Characterisation of Insulating Layers in Metal Core PCB

Klarmann

Vagapov

Gotzig

2021

2021 28th International Workshop on Electric Drives: Improving Reliability of Electric Drives (IWED)

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This paper provides a steady-state thermal characterisation of advanced insulating layers for isotropic electroconductive adhesive based Metal Core Printed Circuit Boards. Thermal measurements were conducted using the Thermal Transient Tester to analyse the properties of layers applied onto two different base materials -aluminium and copper. For each base material, four types of insulating layers were characterised. Size of the specimen plate for both base materials was selected as 100mm x 20mm x 1mm. The isotropic electroconductive adhesive was applied onto insulating layers to ensure electrical connection between seven SMD heat-generating components. These components are mounted in the identical distance to each other. The thermal characterisation of power SMD components and the assembling process based on isotropic electroconductive adhesive were evaluated. Application of advanced insulating layer was analysed to assess the thermal performance of complete MCPCB structure. It has been shown that the lowest thermal resistance of the aluminium based insulating layers is 21.1K/W, whereas the lowest thermal resistance of the copper based insulating layer is 15.5K/W.

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Work in Progress: Competence Building in Engineering Education in Mongolia

Tzanova

2020

2020 IEEE Global Engineering Education Conference (EDUCON)

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Investigations on Heat Extraction in Multilayer PCB Structures

Cited by 4 publications

References 4 publications

Experimental Performance Analysis of Advanced Layers for Electronic Circuit Boards

Experimental Performance Analysis of Advanced Layers for Electronic Circuit Boards

Thermal Characterisation of Insulating Layers in Metal Core PCB

Work in Progress: Competence Building in Engineering Education in Mongolia

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