Experimental Performance Analysis of Advanced Layers for Electronic Circuit Boards

Abstract

This paper provides an experimental performance analysis of advanced layers for electronic circuit boards. The base material of the advanced layers used in the experiments is Al-5052, with the dimensions of 100mm x 20mm x 1mm. As insulating material between the base and conductor, two aluminium coatings were investigated and the surface structure and thermal conductivity of the coatings were examined. Furthermore, three electroconductive adhesives were applied onto the coatings. Initially, electrical performance is investigated and electrical components were applied onto the new surface structure. Finally, the environmental tests were performed to determine the robustness of the evaluated system.

Thermal Characterisation of Insulating Layers in Metal Core PCB

“…The thermal performance of advanced insulating layers for aluminium based MCPCB has been numerically evaluated in [17]. The experimental performance of advanced insulating layers in aluminium based MCPCBs for high power applications was demonstrated and analysed in [18]. It showed and discussed the successfully conducted process of applying high power components onto advanced insulating layers with the help of isotropic electroconductive adhesive.…”

“…It showed and discussed the successfully conducted process of applying high power components onto advanced insulating layers with the help of isotropic electroconductive adhesive. Consequently, MCPCB structure based on advanced insulating layers and isotropic electroconductive adhesive was successfully tested using a standard automotive grade environmental test [18].…”