Investigations of the effects of blade type, dicing tape, blade preparation and process parameters on 55nm node low-k wafer

Shi, Koh Wen; Yow, K. Y.; Rachel, Khoo

doi:10.1109/iemt.2010.5746663

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Figure 3: Die Chipping Defects By Mil-std-883e1

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“…tape. The cause of the defects was a combining effect of tape thickness, base film material type, and adhesion strength [3], so prior to data collection, optimized process parameters were selected for each tape per its properties.…”

Section: Figure 3: Die Chipping Defects By Mil-std-883ementioning

confidence: 99%

Dicing Tape Evaluation for Wire-Bond and Bumped Flip Chip Wafer Applications

Pan¹,

Li²,

Dang³

et al. 2013

ECS Trans.

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This paper presents evaluation results of dicing tape selection for wire-bond and flip chip wafers in a volume production assembly environment. The goal of this project is to investigate a tape with low material cost, long shelf life and minimal dicing and die picking damages. Tape selection considerations, method and an evaluation plan were established, including inspection criteria for dicing and subsequent assembly steps.

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Section: Figure 3: Die Chipping Defects By Mil-std-883ementioning

confidence: 99%