Dicing Tape Evaluation for Wire-Bond and Bumped Flip Chip Wafer Applications

Abstract

This paper presents evaluation results of dicing tape selection for wire-bond and flip chip wafers in a volume production assembly environment. The goal of this project is to investigate a tape with low material cost, long shelf life and minimal dicing and die picking damages. Tape selection considerations, method and an evaluation plan were established, including inspection criteria for dicing and subsequent assembly steps.