2020
DOI: 10.1109/ted.2020.2976106
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Investigation of the Thermal Recovery From Reset Breakdown of a SiN x -Based RRAM

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Cited by 11 publications
(4 citation statements)
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“…The relative contribution of these current paths to the total LRS current is influenced by the strength of the metallic filament connection within the dielectric layer. Therefore, the total temperature dependence of the resistance of the CBRAM is determined by the balance between the current flowing through the dielectric and the metallic filament; a negative correlation to the former and a positive correlation to the latter . According to Figure b, both negative and positive temperature dependence of the LRS resistance are measured.…”
Section: Resultsmentioning
confidence: 97%
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“…The relative contribution of these current paths to the total LRS current is influenced by the strength of the metallic filament connection within the dielectric layer. Therefore, the total temperature dependence of the resistance of the CBRAM is determined by the balance between the current flowing through the dielectric and the metallic filament; a negative correlation to the former and a positive correlation to the latter . According to Figure b, both negative and positive temperature dependence of the LRS resistance are measured.…”
Section: Resultsmentioning
confidence: 97%
“…Therefore, the total temperature dependence of the resistance of the CBRAM is determined by the balance between the current flowing through the dielectric and the metallic filament; a negative correlation to the former and a positive correlation to the latter. 57 According to Figure 5b, both negative and positive temperature dependence of the LRS resistance are measured. However, the dominant correlation is positive, which is a typical characteristic observed in a metallic resistor.…”
Section: Tem Observation Of the Co Pillar Growthmentioning
confidence: 99%
“…36 Moreover, the metallic behavior is confirmed by the temperature dependence of Ti/a-BN/Si devices in the low-resistance state (LRS) following a positive SET process with high compliance current (Figure S4). 60 B vacancies inside the BN layer can also be involved in the resistive switching. The gradual switching suggests that multiple filaments can be ruptured sequentially by the applied voltage.…”
Section: ■ Experimental Proceduresmentioning
confidence: 99%
“…According to the references [ 8 , 9 ], the precise control of ion migration in the resistive switching devices is the performance selection criteria for neuromorphic applications. However, the realization of resistive switching from TS to MS by tuning the Si dangling bond conductive pathway in Si-based RRAM devices is less reported [ 25 , 26 , 27 , 28 , 29 , 30 ].…”
Section: Introductionmentioning
confidence: 99%