Investigation of the diffusion behavior in Sn-xAg-yCu/Cu solid state diffusion couples

Abstract

The interfacial reactions and growth behavior of the Cu 3 Sn and Cu 6 Sn 5 phases in Sn-3.0%Ag-0.5%Cu/Cu and Sn-3.5%Ag-0.7%Cu/Cu diffusion couples were investigated at 130°C, 150°C, 170°C and 200°C and compared with those in binary Sn/Cu diffusion couples using identical experimental conditions. The Ag solubility in the Cu 3 Sn and Cu 6 Sn 5 phases was found to be quite small. The parabolic growth constants of Cu 3 Sn and Cu 6 Sn 5 in Sn-xAg-yCu/Cu diffusion couples were calculated. A transient stage for the growth of Cu 3 Sn was observed. A pseudo-binary method was proposed and performed to obtain the integrated interdiffusion coefficients and activation energies for diffusion of the intermetallics with limited solubility in one of the elements. The growth of Cu 3 Sn in Sn-xAg-yCu/Cu diffusion couples was found to be a little slower than that in binary Sn/Cu diffusion couples. The growth rate of the Cu 6 Sn 5 phase in ternary Sn-xAg-yCu/Cu diffusion couples is quite close to

Influence of External Interface Normal Stress on the Growth of Cu–Sn IMC During Aging

“…The reaction interface and the IMC grains were observed by an FEI Quanta 600 scanning electron microscope (SEM). The thickness of IMC was calculated by a traditional approach which is extensively described [12]. The size of IMC grain and its distribution was measured and analyzed by an image analysis software.…”

Diffusion multiple study of Co-Ni-Ti system at 1073 K

“…With annealed diffusion couples, growth rate and integrated diffusion coefficients of the intermediated phases can be calculated based on the composition profile of the diffusion region [22][23][24]. Growth constants of corresponding intermetallic compounds were calculated using equation (1…”