Development of growth model on interfacial intermetallic compound at circular Cu/Sn3.5Ag interface

In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage

“…In electronic packaging industries [1], Pb-free Sn-Ag solders have been widely utilized for chip joint processing during the manufacturing of cheaper large-volume consumer products owing to their reasonable costs, good soldering performance, superior mechanical properties, as well as high resistance to thermal fatigue [2,3]. One of the notable reliability challenges in the context of lead-free Sn-based solder alloys is the formation of brittle intermetallic compounds (IMCs) [3][4][5][6][7][8]. The formation of Cu 6 Sn 5 IMCs in Sn/Cu, Sn-Ag/Cu, and Sn-Ag-Cu/Cu during reflow soldering is mainly governed by the grain boundary diffusion of Cu into the solder, and this is again influenced by the interfacial grain orientation or Ag 3 Sn nano-particles in cooling stage [2,[9][10][11][12][13].…”