Investigation of modern electrically conductive adhesives for die-attachment in power electronics applications

Abstract

In the year 2006 a ban of lead containing solders in the EU required the qualification of lead-free solder alloys. However, these do not provide the same characteristics as lead containing solders do. Also their costs are higher due to expensive machinery use and increased tin and silver contents. The aim of our research is to develop assemblies based on electrically conductive adhesives that have better characteristics than solder. In this paper three electrically conductive adhesives are investigated. Their thermal and electrical conductivities are compared to the respective properties of solders. In addition mechanical analyses are accomplished so that adhesive strengths on several substrates can be compared even after aging and fatigue. Overall, this work showed that electrically conductive adhesives can be an alternative to solders for the conductive assembly of high-power devices.

A Comprehensive Study on the Automation Potentials and Complexities of Advanced and Alternative Die-Attach Technologies for Power Electronic Applications

“…The development of recent years brought up new conductive adhesive materials such as sinter adhesives [10] or highly thermal and electrical conductive adhesives that have shown their potentials with respect to performance as well as reliability in first research studies. [11] Reactive Multilayer Materials (RMM). Reactive multilayers represent an innovative way to realize new soldering and joining processes.…”

Shear Strength of Conductive Adhesive Joints on Rigid and Flexible Substrates Depending on Adhesive Quantity

“…The mechanical properties of soldered joints, especially their mechanical shear strength, have been well researched, and the results published in many articles (eg [8]), but the corresponding properties of electrically conductive adhesives are looked at only in a very few articles (eg [9]). The mechanical shear strength of conductive adhesives is an important topic which it is necessary to investigate.…”