Shear Strength of Conductive Adhesive Joints on Rigid and Flexible Substrates Depending on Adhesive Quantity

Abstract

This article deals with the impact of electrically conductive adhesive quantity on the shear strength of joints glued by adhesives "EPO-TEK H20S" and "MG 8331S" on three types of substrates (FR-4, MELINEX ST504, DuPont TM Pyralux AC). These joints were made by gluing chip resistors 1206, 0805 and 0603, with two curing profiles for each adhesive. Different thicknesses of stencil and reductions in the size of the hole in stencils were used for this experiment. These differences have an effect on the quantity of conductive adhesives which must be used on the samples. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the effects of different curing profiles, various types of substrates, and different quantities of adhesives on the mechanical strength of the joint.

Assembly of Surface-Mounted Devices on Flexible Substrates by Isotropic Conductive Adhesive and Solder and Lifetime Characterization

“…Common assembly technologies for SMDs on flexible and hybrid electronics are soldering and methods using isotropic conductive adhesives (ICA) [13,14]. Although soldering provides higher mechanical reliability compared to conductive adhesive bonding, sufficient reliability with conductive adhesive bonding can be achieved by process and material optimization [10,15]. Even though the assembly of SMDs on foils is an industry standard, there is little literature available on reliability, especially under dynamic bending conditions [16][17][18][19][20].…”