“…The Ti adhesion layer must conform to the vias and should be as thin as possible, so that very little cross-sectional area is occupied by the somewhat resistive adhesion material. The success of deposition is measured by the bottom coverage, which is defined as the ratio of Ti film thickness at the bottom of the vias to the thickness deposited on the top surface of the interlayer dielectrics (ILD) [2][3][4][5][6].…”